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0.4mm Pitch BGA SMT PCB Assembly With Mixed Technology Low-To-High Volume Assembly

0.4mm Pitch BGA SMT PCB Assembly With Mixed Technology Low-To-High Volume Assembly

Low-To-High SMT PCB Assembly

Mixed SMT PCB Assembly

0.4mm SMT PCB Assembly

Place of Origin:

Shenzhen,China

Brand Name:

Sky-Win Technology

Certification:

RoHS

Model Number:

PCBA-027

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Product Details
Product Type:
SMT PCB Assembly
Solder Mask Color:
Blue.green.red.black.white.etc
Item:
0.4mm Pitch BGA
Material:
FR4 CEM1 CEM3 Hight TG
Application:
PCBA Circuit Board
Layers:
1-32
Copper Thickness:
0.25 Oz -12 Oz
Name:
Factory SMT Pcb Assembly
Base Material:
CEM3,FR1,high TG FR4
Surface Finishing:
HASL/OSP/ENIG
Type:
Mixed Technology
Pcb Standard:
IPC-A-610 E
Payment & Shipping Terms
Minimum Order Quantity
100 piece
Price
$0.1- $4.9
Packaging Details
Carton
Delivery Time
3-15days
Payment Terms
T/T, D/A, D/P
Supply Ability
1000pcs per months
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Product Description

0.4mm Pitch BGA SMT PCB Assembly With Mixed Technology Low-To-High Volume Assembly
 
Applications Of SMT PCB Assembely Service
As the Surface Mount Technology picked up momentum, there has been a constant increase in the usage of this technique across many industries. The market share of SMT assembly services has been increasing by the day.
Some of the industries that utilize Skywin for SMT PCB assembly:
Telecommunication & Mobile communications
Industrial PC
LED components
Medical
Automotive
 
SMT PCB Assembly  Technical Parameters 

ItemsPCBA capacity
Product nameSMT circuit board manufacturer custom electronic assembly pcb pcba
Assembly detailsSMT and Thru-hole, ISO SMT and DIP lines
Testing on productsTesting jig/mold , X-ray Inspection, AOI Test, Functional test
QuantityMin quantity : 1pcs. Prototype, small order, mass order, all OK
Files neededPCB : Gerber files(CAM, PCB, PCBDOC)
Components : Bill of Materials(BOM list)
Assembly : Pick-N-Place file
PCB Panel SizeMin size : 0.25*0.25 inches(6*6mm)
Max size : 1200*600mm
Components detailsPassive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine BGA Pitch to 0.2mm(8mil)
BGA Repair and Reball
Part Removal and Replacement
Component packageCut Tape, Tube, Reels, Loose Parts
PCB+ assembly processDrilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity

 
Lead Time For Multilayer PCB

Layers
Batch/Days
Sample/Days
Expedited/Days
Double-Layer
10
8
5
Four Layer
12
10
6
Six Layer
12
11

 

6
Eight Layer
14
12
7
Ten Layer
14
12
7
Twelve Layer
16
13
8
Fourteen Layer
16
13
10
Sixteen Layer
18
14
10
......
18
14
10

 
SMT Assembly Testing  And Inspection Capabilities
Sky Win makes it mandatory to perform visual inspections to see if there are any missing or misaligned components or issues with solder bridging. Besides manual reviews, we also use SMT inspection machines for this purpose.
Automated Optical Inspection
Solder Paste Inspection
First Article Inspection
X-ray Testing
In-circuit Testing
Functional Testing
 
Sky Win PCBA Manufacturing capabilities
1. Delivery time:
Prototype production usually takes 12 working days, and small batch production usually takes 15 working days. The detailed lead time depends on many factors, such as component procurement difficulty/testing time, so the final lead time varies from project to project.
Sky Win is in contact with the customer throughout the production process, or the customer can inquire with the project manager at any time.
2. Parts procurement:
Sky Win helps in sourcing/sourcing components with your detailed parts list. We will prepare components from official authorized distributors or international distributors such as Mouser/Digikey. You can also specify your preferred supplier so that we can help you buy directly.
 0.4mm Pitch BGA SMT PCB Assembly With Mixed Technology Low-To-High Volume Assembly 0
 

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