Shenzhen Yideyi Technology Limited Company 86-136-7006-7254 elva@ydypcba.com
Bga Automated PCB Assembly Service

Bga Automated PCB Assembly Service

  • High Light

    Automated PCB Assembly Service

    ,

    Ball Grid Array Assembly

    ,

    double sided bga assembly

  • Base Material
    FR-4, Rogers, Aluminum, CEM-1 OR FR-4, FR4/FR1/ FR2/ FR3/ CEM1/ CEM3/ROGERS/ARLON/ISOLA
  • Item
    Printed Circuit Boards Automated PCB Assembly Ball Grid Array Assembly
  • Layer
    1-60
  • Solder Mask
    Green. Red. Blue. White. Black.Yellow
  • Service
    One-stop Service, Competitive Price, PCB & PCBA & Finished Product Assembly, Professional Engineer, Function Test
  • Min. Line Width
    0.10mm(4mil)
  • Function Test
    100% Functional Test
  • Pcb Standard
    IPC-A-610 D
  • Place of Origin
    China
  • Brand Name
    YDY
  • Certification
    CE ROHS FCC
  • Model Number
    Y-004
  • Minimum Order Quantity
    1pcs
  • Price
    Negotiable
  • Packaging Details
    PCB: Vacuum Packing / PCBA: ESD Packing
  • Delivery Time
    1-30 work days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability
    50000pcs/month

Bga Automated PCB Assembly Service

Printed Circuit Boards Automated PCB Assembly Ball Grid Array Assembly

 

Shenzhen YDY Technology Co., Ltd is to be the most professional PCBA/PCB manufacturer for prototyping and low-volume production to work with in the world. With more than a decade in the field, we are committed to meeting the needs of our customers from different industries in terms of quality, delivery, cost-effectiveness and any other demanding requests.
our services specialize in prototyping & ODM and small-volume production, making your requirment complete on the one-stop destination of boards fabrication and assembly. This arrangement makes your R&D work easy and time-saving. Our professional engineers and technicians will work closely with you through our customer service people to ensure the best quality and quickest possible lead time. Fulfilling thousands of orders daily from around the world, we have established us as the leading supplier of PCB and PCBA services for our consistent quality and excellent services.

 

 

PCB Assembly(SMT) Product Capacity

SMT Capacity
SMT Item Capacity
PCB Max. size 510mm*1200mm(SMT)
Chip component 0201, 0402, 0603, 0805, 1206 package
Min.pin space of IC 0.1mm
Min. space of BGA 0.1mm
Max.precision of IC assembly ±0.01mm
Assembly capacity ≥8 million piots/day
DIP capacity 6 DIP production lines
Assembly testing Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test)

FCT(Functional Circuit Test)

Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement.

 

 

Bga Automated PCB Assembly Service

 

 

We can provide one-stop Pcb Assembly Service service:
 

1. High-end, Small volume and Various kinds of PCBA service offered;

2. Speedy, Flexible and one-stop service in PCBA;

3  Assembly and Purchasing service offered, all components are promisedpurchased 100% from Original factories or their pointed agents;

4. Transparent quotation,cost and benefit are detailedly opened to customer;

5. With professional Engineers and Long-term successful experience in cooperating with customers inland and overseas,all new projects can be developed faster and better than expected;

6. With USA or Japan imported tin cream and tin bar, and 100% AOI testing during production, all PCBAs we made are more reliable.

.Bga Automated PCB Assembly Service

 

 

PCB Assembly application:

PCB Assembly is mainly appliable for the LED lighting, consumer electronics, medical devices, industrial applications, automotive applications, aerospace applications and so on.

Bga Automated PCB Assembly Service

 

 

PCB Assembly(SMT) Product Capacity

SMT Capacity

SMT Item

Capacity

PCB Max. size

510mm*1200mm(SMT)

Chip component

0201, 040206030805, 1206 package

Min.pin space of IC

0.1mm

Min. space of BGA

0.1mm

Max.precision of IC assembly

±0.01mm

Assembly capacity

≥8 million piots/day

DIP capacity

6 DIP production lines

Assembly testing

Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test)


FCT(Functional Circuit Test)

Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement

 

 

 

 

Quality Control:

 

AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Micro BGAs
Chip scale packages
Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional
defects caused by component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing

 

 

Bga Automated PCB Assembly Service

 

 

 

Quality Assurance:
 
Our operations have been accredited by ISO9001:2015, ISO13485:2016, ISO14001:2015 and IATF16949:2016.
 
We believe that we earn your continuous trust as Your reliable partner for EMS by always delivering products that meet or exceed your quality requirements. We employ a strict Quality Management System (QMS) to control the whole production process, so that quality is assured at every level of assembly.
 
Continual Improvemenis initiated through the use of quality policy, quality objective, analysis of data, corrective and preventive actions and management review. This requirement covers both the reactive and proactive action of improvement.
The reactive action are those actions taken to address nonconformities of products, processes and systems such as the correction taken on nonconformity or a defect and the follow-up corrective action to remove the root causes of the nonconformity. This is referred to as problem solving or problem resolution process and is a reactive action.
 
The reactive action are those actions taken to address nonconformities of products, processes and systems such as the correction taken on nonconformity or a defect and the follow-up corrective action to remove the root causes of the nonconformity. This is referred to as problem solving or problem resolution process and is a reactive action.
 
Bga Automated PCB Assembly Service
 
 
 

Q1. What is needed for PCB PCBA quotation? PCB(printed circuit board): Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ,...) PCBA(printed circuit board assembly): PCB information, BOM, (Testing documents...)

 

Q2. What file formats do you accept for PCB PCBA production?
Gerber file: CAM350 RS274X PCB file: Protel 99SE, P-CAD 2001 PCB BOM: Excel (PDF,word,txt)

 

Q3. Are my files safe?
Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole process.All documents from customers are never shared with any third parties.

 

Q4. MOQ?
There is no MOQ in YDY(pcba manufacturer).We are able to handle Small as well as large volume production with flexibility.

 

Q5. How is your delivery date calculated?
Normal sample delivery: Normal production delivery:
Two layers: 2~4 days 8~10 days
Four layers: 3~5 days 9~12 days
Six layers: 5~7 days 12~16 days
Eight layers: 6~8 days 14~16 days
More than ten layers: 8~10 days 15~18 days
It depends on the quantity.

 

Q6. What's your shipping way ?

1. We have our own forwarder to ship goods by DHL, UPS, FEDEX, TNT,EMS. 2. If you have your own forwarder, we can cooperate with them.