Shenzhen Yideyi Technology Limited Company 86-136-7006-7254 elva@ydypcba.com
Double Sided Smt Assembly Service Multilayer Printed Circuit Board Hybrid

Double Sided Smt Assembly Service Multilayer Printed Circuit Board Hybrid

  • High Light

    Double Sided Smt Assembly Service

    ,

    double sided smt process

    ,

    double sided smt soldering

  • Service
    SMT PCBA
  • Type
    SMT PCBA Assembly Service Mulitlayer Printed Circuit Board Hybrid Circuit
  • Copper Thickness
    1oz,0.5-2.0 Oz,1oz~3oz,0.5-5 Oz,
  • Ionic Contamination
    <1.56ug/cm2(NaCl)
  • Peel Strength
    ≥1.4N/mm
  • Drill Hole Diameter
    0.005"-0.255" (0.15mm~6.5mm)
  • Surface
    HASL Lf/Enig/OSP
  • Silkscreen
    White
  • Place of Origin
    China
  • Brand Name
    YDY
  • Certification
    ISO13485, IATF16949, ISO9001,IOS14001
  • Model Number
    M-015
  • Minimum Order Quantity
    1pcs
  • Price
    Negotiable
  • Packaging Details
    Vacuum packing or Anti-static package,Outer:export carton or according to the customer's requirement.
  • Delivery Time
    1-10 working days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability
    50000pcs/month

Double Sided Smt Assembly Service Multilayer Printed Circuit Board Hybrid

SMT PCBA Assembly Service Mulitlayer Printed Circuit Board Hybrid Circuit

 

Shenzhen Yideyi Technology Co., Ltd is a professional PCB&PCBA Solution Service Provider specializing in one-stop service from PCB, components purchasing, PCB assembly to complete products building. Our services include PCB fabrication, PCB assembly,raw material purchasing, components purchasing, test, logistics and other value-added services.

 

We have served many well-known OEM customer who focuses on marketing and designing. Our products are mainly applied in the consumption, security and safety, industrial, medical, Network, automation, measurement, counter device and other fields. With years of experience, we have gained a good reputation among clients in the electronic production field for reasonable prices, rich resources and punctual delivery.Our manufacturing facilities include clean workshops and advanced high-speed SMT lines. Our chip placement precision can reach +0.1MM on integrated circuit parts. It means we can deal with almost all kinds of integrated circuits, such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA. Additionally, we can provide 0201 chip placement, through-hole component insertion and finished product fabrication, test and packing.

 

Quality Management Policy: Consistently satisfy our internal and external customer expectations Continuously improve our process, business systems, products and services Empower our employees and enable them to directly contribute to customer. Embrace and execute a system that assures Total Customer Satisfaction Quality objective: Product pass rate:>99% Timely delivery rate:>98.5% Customer satisfaction rate:>98.5%

 

We have high-qualified management team, experienced R and D team and skilled employees and possess advantaged supply chain, commitment to quality and dedication to our customers service

 

 

Our SMT Advantages:

 

• Strict product liability, taking IPC-A-160 standard

• Engineering pretreatment before production

• Production process control (5Ms)

• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC

• 100% AOI inspection, including X-ray, 3D microscope and ICT

• High-voltage test, impedance control test

• Micro section, soldering capacity, thermal stress test, shocking test

• In-house PCB production

• No minimum order quantity and free sample

• Focus on low to medium volume production

• Quick and on-time delivery

 

 

 

YDY service:

 

1. PCBA, PCB assembly: SMT & PTH & BGA

2. PCBA and enclosure design

3. Components sourcing and purchasing

4. Quick prototyping

5. Plastic injection molding

6. Metal sheet stamping

7. Final assembly

8. Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)

9. Custom clearance for material importing and product exporting

10. PCBA reverse engineering

11. Professtional R&D team

12. PCB Layout Design

 

 

SMT Production processes:

 

Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping

 

Each board is carefully examined by our dedicated inspection team using AOI and high magnification viewers.

Using our X-Ray machine, we test PCBs to component level and all wiring is fully inspected and tested. Flash

testing and earth bonding tests can also be undertaken where required.

 

 

Why Choose Us?

 

 

 

1. High quality and quick service is our long-term target for customer.

We are strictly control the product quality and provide customers good and quick service, your inquiry related to our products or prices will be replied within 24 hours.           

 

2. Well-trained and experienced salesman or engineering can answer all your inquires with fluent English.

 

3.Provide OEM&ODM service, we can help you to design and put into product.

 

4.Quick and fast lead time:

 

For Samples:

2L : 3 to 5 working days

4L :  3 to 7 working days

6~8L: 5 to 8 working days

10~16L: 5 to 10 working days

 

For Mass production:

2L : 8  to 12 working days

4L : 10 to 14 working days

6~8L: 14 to 18 working days

The final lead time based on your PO detail quantity.

 

5. Protection of your sales area, copyright, ideas of design and all your private information,keep customers information confidential is our responsibility.

 

6. Reasonable price and top quality products, lower delivery cost help customers cost down and make customers more competitive in the market.

 

 

 

SMT PCBA Manufacture Capacity

 

Process Item Mass production capability
SMT Printing Max PCB size 900*600mm²
Solder paste printing tolerance ±25μm(6σ)
System repeat calibration tolerance ±10μm(6σ)
Scraper pressure detection pressure closed-loop control system
SPI Detect Min BGA PAD to PAD distance 100μm
x-axis and Y-axis tolerance 0.5μm
False Rate ≤0.1%
Mount Component size 0.3*0.15 mm²--200*125 mm²
Component max height 25.4mm
Populate Max component weight 100g
BGA/CSP Min PAD spacing, and Min PAD diameter 0.30mm,0.15mm
Populate tolerance ±22μm(3σ),±0.05°(3σ)
PCB board size 50*50 mm²-850*560 mm²
PCB thickness 0.3mm--6mm
Max PCB weight 6kg
Populate Max components type 500
AOI Detect Min components 01005
Detect false type Incorrect conponents,missing components,opposite direction,,component shift,Tombstone,Mounting on side,unsoldering,insufficient solder,Lead raised,Solder ball
Foot warping detection 3D Detection function
Reflow Temperature Accuracy ±1ºC
Welding protection nitrogen protection;(remaining oxygen<3000ppm)
Nitrogen Control Nitrogen closed-loop control system,±200ppm
3D X-Ray Magnification Geometric Magnification;:2000 times;System Magnification:12000times
Resolution 1μm /nm
Rotation Angle &Slanting Perspective Any ±45°+360°rotation
DIP Preelaboration Automatic forming technology Component Automatic forming
DIP DIP technology Automatic Insertion machine
Wave soldering Wave soldering type Ordinary wave soldering
Inclination angle of transport guide rail 4--7°
Temperature accuracy ±3ºC
Soldering protection nitrogen protection
Non-welding pressure contact technology Max PCB board size 800*600mm²
Press down height accuracy ±0.02mm
Pressure Range 0-50KN
Pressure Accuracy Standard value:±2%
Hold time 0-9.999S
Conformal coating technology Max PCB board size 500*475*6mm
Max PCB board weight 5kg
Min Nozzle size 2mm
Other characteristic Conformal coating pressure Programmable control
ICT test test level Device level test,Test hardware connection status.
Test point >4096
Test content Contact test ,Open/short test,Resistance capacitance test test,diode, triode,mosfet test,No power on hybrid test,Boundary scan chain test,Power on mixed mode test.
Assembly and test Production type TouchPad Mass production
TWS Mass production
Baby Camera Mass production
Gaming controller Mass production
Life Watch Mass production
FT test test level PCB board system level test.Test System function status.
Temperature cycling test Temperature range -60ºC--125ºC
Rise/lower temperature rate >10ºC/min
Temperature tolerance ≤2ºC

 

Double Sided Smt Assembly Service Multilayer Printed Circuit Board Hybrid 0

 

Double Sided Smt Assembly Service Multilayer Printed Circuit Board Hybrid 1

 

 

 

 

Package &Shipping Methods:

 

1. Vacuum package with silica gel, Carton box with packing belt.

2. By DHL, UPS, FedEx, TNT

3. By EMS

4. By sea for mass quantity according to customer's requirement

 

 

 

 

Full certificate:

Double Sided Smt Assembly Service Multilayer Printed Circuit Board Hybrid 2

 

 

 

FAQ:

 

Q1. How to keep our product information and design file secret ?
We are willing to sign a NDA effect by customers side local law and promising to keep customers data in high confidential level.

 

Q2. What file formats do you accept for production?

Gerber file: CAM350 RS274X

PCB file: Protel 99SE, P-CAD 2001 PCB

BOM: Excel (PDF,word,txt)


Q3. Please note that the following detail will speed up evaluation:
Material:
Board thickness:
Copper thickness:Surface finish:
Solder mask color:
Silkscreen color:

 

Q4. How to make sure the PCBAs are completely well recieved?
We will pack with aluminum bag, and insert card, up and bottom card with stable cartons.

Q5. How to ship the PCBAs?
For small packages, we will ship the boards to you by DHL,UPS,FEDEX,TNT. Door to door service! For mass production, we could ship by air, by sea.

 

Q6. How to make sure the function is fine?
We could make sample/prototype and do functional testing before mass production.

 

Q7.  Trade Terms?

 

Payment: T/T in advance (Western Union ,Alibaba, paypal is welcomed)