Shenzhen Yideyi Technology Limited Company 86-136-7006-7254 elva@ydypcba.com
Pick And Place Smt Pcba Process Ems Components Assembly Printed Circuit Board Soldering

Pick And Place Smt Pcba Process Ems Components Assembly Printed Circuit Board Soldering

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    Pick And Place Smt Pcba Process

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    smt and pcba

    ,

    pcb component pick and place

  • Service
    SMT PCBA
  • Type
    SMT PCBA Surface Mount Circuit Board Assemblies Dynamic Flex Board
  • Copper Thickness
    1oz,0.5-2.0 Oz,1oz~3oz,0.5-5 Oz,
  • Surface Finishing
    HASL,OSP,ENIG,HASL Lead Free,immersion Gold
  • Ionic Contamination
    <1.56ug/cm2(NaCl)
  • Peel Strength
    ≥1.4N/mm
  • Drill Hole Diameter
    0.005"-0.255" (0.15mm~6.5mm)
  • Usage
    OEM Electronics
  • Place of Origin
    China
  • Brand Name
    YDY
  • Certification
    ISO13485, IATF16949, ISO9001,IOS14001
  • Model Number
    M-016
  • Minimum Order Quantity
    1pcs
  • Price
    Negotiable
  • Packaging Details
    Vacuum packing or Anti-static package,Outer:export carton or according to the customer's requirement.
  • Delivery Time
    1-20 working days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability
    50000pcs/month

Pick And Place Smt Pcba Process Ems Components Assembly Printed Circuit Board Soldering

SMT PCBA Surface Mount Circuit Board Assemblies Dynamic Flex Board​

 

Shenzhen Yideyi Technology Co., Ltd is a professional PCBA solution provider,specilizes in PCB production,components procurement,PCBA assembly and a series service of customized flexible LED strips.

 

Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consuming, computer, automotive, aerospace, military and so on. Over 75% of our products are exported to Europe, North America, Japan and other Asia Pacific countries. Based on many years of development, we have high-qualified management team, experienced R&D team and skilled employees,and possess advantaged supply chain, commitment to quality,and dedication to our customers service. Encouraging innovation and keeping improving. Besides achieving corporate and customer values, we also create a favorable atmosphere for employees to achieve personal values.

 

Our goal is to be the leading PCB solutions provider in the electronics industry with first-class products and services. 

 

SMT PCBA capabilities:

 

• SMT assembly including BGA assembly

• Accepted SMD chips: 01005,BGA,QFP,QFN,TSOP

• Component height: 0.2-25mm

• Min packing: 0201

• Min distance among BGA : 0.25-2.0mm

• Min BGA size: 0.1-0.63mm

• Min QFP space: 0.35mm

• Min assembly size: (X*Y): 50*30mm

• Max assembly size: (X*Y): 350*550mm

• Pick-placement precision: ±0.01mm

• Placement capability: 0805, 0603, 0402, 0201

• High pin count press fit available

• SMT capacity per day: 800,000 point

 

 

Advantages:

 

• Strict product liability, taking IPC-A-160 standard

• Engineering pretreatment before production

• Production process control (5Ms)

• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC

• 100% AOI inspection, including X-ray, 3D microscope and ICT

• High-voltage test, impedance control test

• Micro section, soldering capacity, thermal stress test, shocking test

• In-house PCB production

• No minimum order quantity and free sample

• Focus on low to medium volume production

• Quick and on-time delivery

 

Each board is carefully examined by our dedicated inspection team using AOI and high magnification viewers.

Using our X-Ray machine, we test PCBs to component level and all wiring is fully inspected and tested. Flash

testing and earth bonding tests can also be undertaken where required.

 

 

PCB Assembly Manufacturing Procedures:

Program Management

 

PCB Files → DCC → Program Organizing → Optimization → Checking

 

SMT Management

PCB Loader → Screen Printer → Checking → SMD Placement → Checking → Air Reflow → Vision Inspection → AOI → Keeping

 

PCBA Management

THT→Soldering Wave (Manual Welding) → Vision Inspection → ICT → Flash → FCT → Checking → Package → Shipment

 

 

Technical Requirement for PCB Assembly:

 

Professional Surface-mounting and Through-hole soldering Technology

Various sizes like 1206,0805,0603,0402,0201 components SMT technology

ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

PCB Assembly With UL,CE,FCC,Rohs Approval

Nitrogen gas reflow soldering technology for SMT.

High Standard SMT&Solder Assembly Line

High density interconnected board placement technology capacity.

 

DIP capability:

 

• A-8 of semi-assembly work line with 3 set wave soldering machines

• B-4 of high/low-temperature burn-in test ovens for the burn-in tested required products

• All products are 100% inspected and tested during the DIP process

 

All our products follow IPC class and are approved by UL, RoHS and ISO9001. Also our executives and technicians are experienced people who have been engaged in PCB industry for more than twenty years so we have rich production management experience and professional PCB skills. We ensure the quality of PCB products by continuously introducing new equipment′s and new technologies and using high quality materials. With professional technicians we can provide early design consultation and technical support, so that customers can be more worry-free. With qualified and reliable products, advanced technology and value-added service, we won the trusts and supports of customers and established a good reputation in the industry.

 

 

 

SMT PCBA Manufacture Capacity

 

Process Item Mass production capability
SMT Printing Max PCB weight 8kg
Solder paste printing tolerance ±25μm(6σ)
System repeat calibration tolerance ±10μm(6σ)
Scraper pressure detection pressure closed-loop control system
SPI Detect Min BGA PAD to PAD distance 100μm
x-axis and Y-axis tolerance 0.5μm
False Rate ≤0.1%
Mount Component size 0.3*0.15 mm²--200*125 mm²
Component max height 25.4mm
Populate Max component weight 100g
BGA/CSP Min PAD spacing, and Min PAD diameter 0.30mm,0.15mm
Populate tolerance ±22μm(3σ),±0.05°(3σ)
PCB board size 50*50 mm²-850*560 mm²
PCB thickness 0.3mm--6mm
Max PCB weight 6kg
Populate Max components type 500
AOI Detect Min components 01005
Detect false type Incorrect conponents,missing components,opposite direction,,component shift,Tombstone,Mounting on side,unsoldering,insufficient solder,Lead raised,Solder ball
Foot warping detection 3D Detection function
Reflow Temperature Accuracy ±1ºC
Welding protection nitrogen protection;(remaining oxygen<3000ppm)
Nitrogen Control Nitrogen closed-loop control system,±200ppm
3D X-Ray Magnification Geometric Magnification;:2000 times;System Magnification:12000times
Resolution 1μm /nm
Rotation Angle &Slanting Perspective Any ±45°+360°rotation
DIP Preelaboration Automatic forming technology Component Automatic forming
DIP DIP technology Automatic Insertion machine
Wave soldering Wave soldering type Ordinary wave soldering
Inclination angle of transport guide rail 4--7°
Temperature accuracy ±3ºC
Soldering protection nitrogen protection
Non-welding pressure contact technology Max PCB board size 800*600mm²
Press down height accuracy ±0.02mm
Pressure Range 0-50KN
Pressure Accuracy Standard value:±2%
Hold time 0-9.999S
Conformal coating technology Max PCB board size 500*475*6mm
Max PCB board weight 5kg
Min Nozzle size 2mm
Other characteristic Conformal coating pressure Programmable control
ICT test test level Device level test,Test hardware connection status.
Test point >4096
Test content Contact test ,Open/short test,Resistance capacitance test test,diode, triode,mosfet test,No power on hybrid test,Boundary scan chain test,Power on mixed mode test.
Assembly and test Production type TouchPad Mass production
TWS Mass production
Baby Camera Mass production
Gaming controller Mass production
Life Watch Mass production
FT test test level PCB board system level test.Test System function status.
Temperature cycling test Temperature range -60ºC--125ºC
Rise/lower temperature rate >10ºC/min
Temperature tolerance ≤2ºC

 

Pick And Place Smt Pcba Process Ems Components Assembly Printed Circuit Board Soldering 0

 

 

Pick And Place Smt Pcba Process Ems Components Assembly Printed Circuit Board Soldering 1

 

 

 

 

We are devoted to be a trusted partner of our customers.

 

Pick And Place Smt Pcba Process Ems Components Assembly Printed Circuit Board Soldering 2

 

 

Package &Shipping Methods:

 

1. Vacuum package with silica gel, Carton box with packing belt.

2. By DHL, UPS, FedEx, TNT

3. By EMS

4. By sea for mass quantity according to customer's requirement

 

 

 

FAQ:

 

Q1. How to keep our product information and design file secret ?
We are willing to sign a NDA effect by customers side local law and promising to keep customers data in high confidential level.

 

Q2. What file formats do you accept for production?

Gerber file: CAM350 RS274X

PCB file: Protel 99SE, P-CAD 2001 PCB

BOM: Excel (PDF,word,txt)


Q3. Please note that the following detail will speed up evaluation:
Material:
Board thickness:
Copper thickness:Surface finish:
Solder mask color:
Silkscreen color:

 

Q4. How to make sure the PCBAs are completely well recieved?
We will pack with aluminum bag, and insert card, up and bottom card with stable cartons.

Q5. How to ship the PCBAs?
For small packages, we will ship the boards to you by DHL,UPS,FEDEX,TNT. Door to door service! For mass production, we could ship by air, by sea.

 

Q6. How to make sure the function is fine?
We could make sample/prototype and do functional testing before mass production.

 

Q7. What  Trade Terms do you accept?

Payment: T/T in advance (Western Union , paypal is welcomed)