Shenzhen Yideyi Technology Limited Company 86-136-7006-7254
0.5mm Quick Turn Rigid Flex Pcb Hard Gold Plating Low Cost Pcb Prototype

0.5mm Quick Turn Rigid Flex Pcb Hard Gold Plating Low Cost Pcb Prototype

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    0.5mm Quick Turn Flex Pcb


    0.5mm quick turn flex circuits


    0.5mm quick turn rigid flex pcb

  • Service
    24Hours Technical Services
  • Type
    0.5mm Hard Gold Plating Circuit Card Assembly Design Rigid Flexible PCB
  • Surface
    HASL Lf/Enig/OSP
  • Copper Thickness
  • Min. Line Width
  • Shaping
    CNC Routing,Punching,V-CUT, Depth Milling, Castellation
  • Max Aspect Ratios
    Max Aspect Ratios
  • Min Soldermask Bridge Width
    4mil (0.1mm)
  • Place of Origin
  • Brand Name
  • Certification
    ISO13485, IATF16949, ISO9001,IOS14001
  • Model Number
  • Minimum Order Quantity
  • Price
  • Packaging Details
    Vacuum packing or Anti-static package,Outer:export carton or according to the customer's requirement.
  • Delivery Time
    1-15 working days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability

0.5mm Quick Turn Rigid Flex Pcb Hard Gold Plating Low Cost Pcb Prototype

0.5mm Hard Gold Plating Circuit Card Assembly Design Rigid Flexible PCB



YDY is your best choice for manufacturing your electronic products in China at lowest possible cost:


At one stop turn key solution, Our key manufacturing process are involved with following process:


•  PCB fabrication (rigid and flexible boards)

•  Component sourcing

•  PCB assembly (Printed Circuit boards Assembly)

•  Finished goods assembly

• PCB boards with wires

• PCB boards with plastic enclosures

• PCB boards with metal enclosures

• Gerber File And BOM List PCBA

•  PCBA copy

• PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board



Rigid Flexible PCB capability


Process capability
product type
FR-4, High Tg, Aluminium, Copper PCB, Ceramic PCB, Polyimide PCB, Rigid-flex PCB
Max layer count
20 layers
Min base copper thickness
1/3 OZ (12um)
Max finished copper thickness
10 OZ (350um)
Min trace width/spacing(Inner layer)
2/2mil (0.05mm)
Min trace width/spacing(Outer layer)
2/2mil (0.05mm)
Min spacing between hole to inner layer conductor
6mil (0.15mm)
Min spacing between hole to outer layer conductor
6mil (0.15mm)
Min annular ring for via
4mil (0.1mm)
Min annular ring for component hole
4mil (0.1mm)
Min BGA diameter
4mil (0.1mm)
Min BGA pitch
4mil (0.1mm)
Min hole size
0.15mm(CNC); 0.1mm(Laser)
Max aspect ratios
Min soldermask bridge width
4mil (0.1mm)
Soldermask/circuit processing method
Min thickness for insulating layer
1mil (0.025mm)
HDI & special type PCB
HDI(1-3 steps), R-FPC(2-16 layers), High frequency mix-pressing(2-14 layers), Buried capacitance & resistance, 0.14mm to 0.2mm
extra thinner pcb,high heat conducting thermoelectric separation copper based pcb, etc
Surface treatment type
ENIG, HAL, HAL lead free, OSP, Immersion Sn, mmersion silver, Plating hard gold,Plating silver, carbon oil, ENIG immersion tin
Max PCB size
Multi-layer: 600*550mm 1-2 layer: 500*1200MM


Rigid-flex PCBs provide the best benefits of rigid and flex PCBs in one solution. Applications where rigid flex PCBs excel are:


1. High-reliability applications. If an assembly will be exposed to excessive or repeated shock, or high vibration environments, connectors with flexible cables are more likely to fail. Rigid flex PCBs provide great reliability even when subjected to extreme vibration and shock applications.
2. High-density applications. Within a small enclosure, it’s sometimes impossible to accommodate all of the cables and connectors that an electronic PCB design would require. Rigid flex boards can fold into very small, and very thin profiles, offering substantial space savings in these instances.
3. Five or more rigid boards. If your application will ultimately involve five or more rigid boards connected to one another with flex cables, an integrated rigid flex solution is often the optimal and most cost-effective choice.


Rigid-flex PCBs are a means to streamline the electronic design, by eliminating flexible cables, connectors and discrete wiring. The electrical performance of a rigid flex PCB is enhanced compared to its counterparts, because the circuits are integral to the overall construction. All of the electrical and mechanical connections are internally contained within the rigid-flex PCB, providing the electronics designer with much improved service reliability and electrical performance.



Our boards manufactured are wildly used on many industries, such as Industrial controlMCU control , Smart Home , Tele-communication , Automobile ,Programming controlWireless ,Medical ,LED control and Consumer Electronics.


0.5mm Quick Turn Rigid Flex Pcb Hard Gold Plating Low Cost Pcb Prototype 0



YDY with great experience in EMS manufacturing and management


0.5mm Quick Turn Rigid Flex Pcb Hard Gold Plating Low Cost Pcb Prototype 1


Shenzhen Yideyi Technology Co., Ltd is a manufacturer specializing in the research & development, manufacture and marketing of PCB boards. We have had about 300 workers. Our company was established in Shenzhen City of Guangdong Province in 2008. Covering an area of 2400 square meters, our workshops are equipped with about 60 binding machines.





Q1. How to keep our product information and design file secret ?
We are willing to sign a NDA effect by customers side local law and promising to keep customers data in high confidential level.


Q2. What kind of PCB file format can you accept for production?


Q3. What’s the MOQ?
We are able to handle Small as well as large volume production with flexibility.


Q4. How can we guarantee you receive an good quality product?

For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.


Q5. What’s the key equipments for HDI manufacturing?
Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.


Q6. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.