Shenzhen Yideyi Technology Limited Company 86-136-7006-7254
2mil Fpc Double Sided Rigid Flex PCB Quick Turn Rapid Pcb Assembly

2mil Fpc Double Sided Rigid Flex PCB Quick Turn Rapid Pcb Assembly

  • High Light

    Double Sided Rigid Flex PCB


    Rigid Flex PCB Quick Turn


    Fpc Rigid Flex PCB

  • Type
    Rigid Flexible PCB
  • Name
    -2mil Pcb Component Assembly Rapid Pcb Assembly Rigid Flexible PCB
  • Surface
    HASL Lf/Enig/OSP
  • Copper Thickness
  • Min. Line Width
  • Max Aspect Ratios
  • Hole Tolerance
    PTH: +/-3mil NPTH: +/-2mil
  • Assembly Service
    SMT Service
  • Place of Origin
  • Brand Name
  • Certification
    ISO13485, IATF16949, ISO9001,IOS14001
  • Model Number
  • Minimum Order Quantity
  • Price
  • Packaging Details
    Vacuum packing or Anti-static package,Outer:export carton or according to the customer's requirement.
  • Delivery Time
    1-10 working days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability

2mil Fpc Double Sided Rigid Flex PCB Quick Turn Rapid Pcb Assembly

-2mil Pcb Component Assembly Rapid Pcb Assembly Rigid Flexible PCB



More service from YDY:


1. Low Volume Pcb Manufacture

2. PCBA and enclosure design

3. Components sourcing and purchasing

4. Quick prototyping

5. Plastic injection molding

6. Metal sheet stamping

7. Final assembly

8. Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)

9. High volume pcb manufacturing

10. PCBA reverse engineering

11. Double Sided PCB Manufacturing Process

12. Circuit diagram deign



Rigid Flexible PCB Capability

Process capability
product type
FR-4, High Tg, Aluminium, Copper PCB, Ceramic PCB, Polyimide PCB, Rigid-flex PCB
Max layer count
20 layers
Min base copper thickness
1/3 OZ (12um)
Max finished copper thickness
10 OZ (350um)
Min trace width/spacing(Inner layer)
2/2mil (0.05mm)
Min trace width/spacing(Outer layer)
2/2mil (0.05mm)
Min spacing between hole to inner layer conductor
6mil (0.15mm)
Min spacing between hole to outer layer conductor
6mil (0.15mm)
Min annular ring for via
4mil (0.1mm)
Min annular ring for component hole
4mil (0.1mm)
Min BGA diameter
4mil (0.1mm)
Min BGA pitch
4mil (0.1mm)
Min hole size
0.15mm(CNC); 0.1mm(Laser)
Max aspect ratios
Min soldermask bridge width
4mil (0.1mm)
Soldermask/circuit processing method
Min thickness for insulating layer
1mil (0.025mm)
HDI & special type PCB
HDI(1-3 steps), R-FPC(2-16 layers), High frequency mix-pressing(2-14 layers), Buried capacitance & resistance, 0.14mm to 0.2mm
extra thinner pcb,high heat conducting thermoelectric separation copper based pcb, etc
Surface treatment type
ENIG, HAL, HAL lead free, OSP, Immersion Sn, mmersion silver, Plating hard gold,Plating silver, carbon oil, ENIG immersion tin
Max PCB size
Multi-layer: 600*550mm 1-2 layer: 500*1200MM



What are Rigid-Flex PCB's?


Rigid-Flex PCB’s are made by the combination of rigid and flexible PCB’s, hence they have characteristics of both types of PCB’s. A rigid PCB is connected to a flexible PCB integrated together through a strong electrical connection. Flexible boards consist of multiple layers of flexible substrates that are connected to each other by internal or external circuitary. Rigid-Flex PCB Boards are sort of a hybrid with parts of the PCB being Rigid and other parts being flexible based on the application or requirement. The circuit boards can be developed to be rigid where extra support is needed and flexible where they circuit might need to be bent.


Features and benefits:
Excellent flexibility
Reducing the volume
Weight reduction
Consistency of assembly
Increased reliability
Controllability of electrical parameter design
the end can be whole soldered
Material optionality
Low cost
Continuity of processing
Professional and experienced engineers
High technology


Brief Introduction of RFPC:

RFPC is a Printed circuit board made of flexible insulating substrate (mainly polyimide or polyester Film), which has many advantages that rigid printed circuit boards do not have. for example,
It can be freely bent, wound, folded. the volume of electronic products can be greatly reduced by using RFPC, which is suitable for the development of electronic products in the direction of High density, miniaturization and high reliability. Therefore, FPC has been widely used in Aerospace, military, mobile communication, laptop, computer peripherals, PDA, digital Camera and other fields or products.


2mil Fpc Double Sided Rigid Flex PCB Quick Turn Rapid Pcb Assembly 0



THe excellent OEM (manufacturing) and ODM (design) service, YDY also provides more value added services to our customers, and help them to achieve their business goals.


2mil Fpc Double Sided Rigid Flex PCB Quick Turn Rapid Pcb Assembly 1





Q1. How many types of surface finish O-lead can do?
We has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. ..

OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


Q2. What kind of PCB file format can you accept for production?


Q3. How do we ensure quality?
Our high quality standard is achieved with the following.
1. The process is strictly controlled under ISO 9001:2008 standards.
2. Extensive use of software in managing the production process
3. State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
4. Dedicated quality assurance team with failure case analysis process
5. Continuous staff training and education


Q4. How can we guarantee you receive an good quality product?

For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.


Q5. What’s the key equipments for HDI manufacturing?
Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.


Q6. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.