Shenzhen Yideyi Technology Limited Company 86-136-7006-7254 elva@ydypcba.com
Quick Turn Pcb Prototype Assembly 4 Layer Production Printed Circuit Board Service

Quick Turn Pcb Prototype Assembly 4 Layer Production Printed Circuit Board Service

  • High Light

    3oz Quick Turn Pcb Prototype Assembly

    ,

    3oz Pcb Prototype 4 Layer

    ,

    Prototype Pcb Universal Printed Circuit Board

  • Type
    PCBA Prototype
  • Name
    Quick PCBA Prototype Flexible Pcb Assembly Electronic Circuit Assembly
  • Surface
    HASL Lf/Enig/OSP
  • Copper Thickness
    0.3-3oz
  • Min. Line Width
    0.075mm/0.1mm(3mil/4mil)
  • Shaping
    CNC Routing,Punching,V-CUT, Depth Milling, Castellation
  • Hole Tolerance
    PTH: +/-3mil NPTH: +/-2mil
  • Profiling Punching
    Punching
  • Place of Origin
    China
  • Brand Name
    YDY
  • Certification
    ISO13485, IATF16949, ISO9001,IOS14001
  • Model Number
    M-01
  • Minimum Order Quantity
    1pcs
  • Price
    Negotiable
  • Packaging Details
    Vacuum packing or Anti-static package,Outer:export carton or according to the customer's requirement.
  • Delivery Time
    1-10 working days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability
    50000pcs/month

Quick Turn Pcb Prototype Assembly 4 Layer Production Printed Circuit Board Service

Quick PCBA Prototype Flexible Pcb Assembly Electronic Circuit Assembly

 

 

Shenzhen Yideyi Technology Co., Ltd established in 2008 with 200 employees and 25000sq.m Of production and office area. We can offer one-stop service from PCB designing, manufacturing to PCB assembling, testing and housing. with in-time delivery after more than 13 years of successful experience on the global EMS market. Our PCB production capacity can reach 40000 sq.m. per month and EMS assembling capacity at 150,000,000 components per month.

 

 

Our service:

 

Turnkey PCB Assembly
PCB Assembly Service
Quick Turn PCB Assembly
EMS PCB Assembly
SMT PCBA
PCBA Prototype
Flex PCBA
Electronics PCB Design
PCB Reverse Engineering
Multilayer Printed Circuit Board

 

 

 

PCBA Capability

Board Thickness 0.4-8mm 0.1-0.5mm 0.4-3mm
Board Thickness Tolerance(<1.0mm) ±0.1mm ±0.05mm ±0.1mm
Impedance Tolerance Single-Ended:±5Ω(≤50Ω),±7%(>50Ω) Single-Ended:±5Ω(≤50Ω),±10%(>50Ω) Single-Ended:±5Ω(≤50Ω),±10%(>50Ω)
Differential:±5Ω(≤50Ω),±7%(>50Ω) Differential:±5Ω(≤50Ω),±10%(>50Ω) Differential:±5Ω(≤50Ω),±10%(>50Ω)
Max Board Size 22.5*30inch 9*14inch 22.5*30inch
Contour Tolerance ±0.1mm ±0.05mm ±0.1mm
Min BGA 7mil 7mil 7mil
Surface Treatment ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold;Hard gold plating ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold;Hard gold plating ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold;Hard gold plating
Solder Mask Green,Black,Blue,Red,Matt Green Green Solder Mask/Black PI/Yellow PI Green,Black,Blue,Red,Matt Green
Min Solder Mask Clearance 1.5mil 3mil 1.5mil
Min Solder Mask Dam 3mil 8mil 3mil
Min Legend Width/Height 4/23mil 4/23mil 4/23mil

 

 

What is PCBA Prototype?

Engineers designing printed circuit boards (PCBs) commonly generate a prototype board prior to full-scale manufacturing of boards for end products. ... Prototypes may be developed for limited-function boards to test proof-of-concept of single functions, before production of a more complex finished product.

 

PCB manufacture

FR-4 PCB,High TG FR-4 PCB,Heavy copper PCB,Impedance control PCB, High frequency PCBFlexible PCB,
Rigid-flex PCB, HDI PCB, Aluminum PCB, Copper based PCB, Ceramic based PCB

 

PCB assembly

SMT,DIP,Reflow soldering,Wave soldering,Hand soldering,Mixed assembly technologies,Cable assembly,PCBA testing,Final product assembly

 

Components sourcing

Firsthand components,Original manufacturers,BOM checking,Components according to BOM,All round supply chain management system,Supplier quality engineer team to manage quality

 

PCBA design and clone

Hardware engineers,Software engineers,Schematic design,PCB layout,Software development,PCBA clone

 

Quick Turn Pcb Prototype Assembly 4 Layer Production Printed Circuit Board Service 0

 

 

YDY builds all round supply chain management system and ERP system.

The excellent OEM (manufacturing) and ODM (design) service, YDY also provides more value added services to our customers, and help them to achieve their business goals.

 

Quick Turn Pcb Prototype Assembly 4 Layer Production Printed Circuit Board Service 1

 

 

FAQ:

 

Q1. How many types of surface finish O-lead can do?
We has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. ..

OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

 

Q2. What kind of PCB file format can you accept for production?
Gerber, PROTEL 99SE, PROTEL DXP, CAM350, ODB+(.TGZ)

 

Q3. How do we ensure quality?
Our high quality standard is achieved with the following.
1. The process is strictly controlled under ISO 9001:2008 standards.
2. Extensive use of software in managing the production process
3. State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
4. Dedicated quality assurance team with failure case analysis process
5. Continuous staff training and education

 

Q4. How can we guarantee you receive an good quality product?

For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.

 

Q5. What’s the key equipments for HDI manufacturing?
Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.

 

Q6. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.