Shenzhen Yideyi Technology Limited Company 86-136-7006-7254
Aluminum 4 Layer Pcb Prototype Assembly ERP Material Process Management

Aluminum 4 Layer Pcb Prototype Assembly ERP Material Process Management

  • High Light

    Aluminum PCB Prototype Assembly


    4 Layer Pcb Prototype Assembly


    aluminum base pcb manufacturer

  • Type
    PCBA Prototype
  • Name
    PCBA Prototype ERP Material And Process Management Aluminum PCB Prototyping
  • Copper Thickness
  • Min. Line Width
  • Shaping
    CNC Routing,Punching,V-CUT, Depth Milling, Castellation
  • Profiling Punching
  • Base Material
  • Silkscreen Color
    White Black Yellow Green Red
  • Place of Origin
  • Brand Name
  • Certification
    ISO13485, IATF16949, ISO9001,IOS14001
  • Model Number
  • Minimum Order Quantity
  • Price
  • Packaging Details
    Vacuum packing or Anti-static package,Outer:export carton or according to the customer's requirement.
  • Delivery Time
    1-10 working days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability

Aluminum 4 Layer Pcb Prototype Assembly ERP Material Process Management

PCBA Prototype ERP Material And Process Management Aluminum PCB Prototyping


Shenzhen Yideyi Technology Co., Ltd established in 2008, located in Shenzhen, China, is a hi-tech company, which specializes in fabricating high precision, high density and high reliability PCB from 1 to 30 layers.We supply the service of pcb design,pcb clone and pcba assembly.

We will do fly probe test pcb,AOI or X-Ray for test pcba.


Our export Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe.



Our Service


1. Quick PCBA decode, we can provide 2-3pcs physical PCBA samples for customers' verified purpose within 2-3 weeks.

2. PCB Assembly for mass production, daily capability is 150000pcs of PCBAs.

3. PCBA prototypes quick making within 2-3 weeks.

4. Professional engineering team for PCB Layout, PCB Design.

5. Box Build (Electronic Finished Products Assembly)

6. Components Sourcing for customers at VAT cost.

7. Since the price of electronic materials has risen sharply in recent two years, we are positive to find alternatives with good quality to optimize and reduce material cost.



PCBA Capability

Items PCBA capacity
Product name SMT circuit board manufacturer custom electronic assembly pcb pcba
Assembly details SMT and Thru-hole, ISO SMT and DIP lines
Testing on products Testing jig/mold , X-ray Inspection, AOI Test, Functional test
Quantity Min quantity : 1pcs. Prototype, small order, mass order, all OK
Files needed PCB : Gerber files(CAM, PCB, PCBDOC)
Components : Bill of Materials(BOM list)
Assembly : Pick-N-Place file
PCB Panel Size Min size : 0.25*0.25 inches(6*6mm)
Max size : 1200*600mm
Components details Passive Down to 0201 size
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine BGA Pitch to 0.2mm(8mil)
BGA Repair and Reball
Part Removal and Replacement
Component package Cut Tape, Tube, Reels, Loose Parts
PCB+ assembly process Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity



Rapid PCBA prototyping is the ideal service for high complexity electronics projects that are under tight development deadlines. Experience seamless ordering, seamless DFM resolution, an accessible and responsive build team, and industry leading turn times and quality.

Capabilities include rigid, HDI, stacked micro-vias, fine-pitch BGA and QFN assembly. Design complexity will have implications for PCBA prototype build price, lead time, and DFM.




Focusing on PCBA fabrications, we are adopted advanced SMT equipment from Germany and Japan, high-speed placement machine, automatic press machine as well as 10 temperature re-flow soldering machine. Our PCBA assemblies and dustless workshop is guaranteed by the AOI and X-ray detection and certificated with ISO9001. The reliable quality of PCBA is ensured from working staff, raw materials, equipment, environment and system management.



Production processes:


Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping


Aluminum 4 Layer Pcb Prototype Assembly ERP Material Process Management 0


Aluminum 4 Layer Pcb Prototype Assembly ERP Material Process Management 1






Q1. What kinds of boards can O-Leading process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc


Q2. What kind of PCB file format can you accept for production?


Q3. How do we ensure quality?
Our high quality standard is achieved with the following.
1. The process is strictly controlled under ISO 9001:2008 standards.
2. Extensive use of software in managing the production process
3. State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
4. Dedicated quality assurance team with failure case analysis process
5. Continuous staff training and education


Q4. How can we guarantee you receive an good quality product?

For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.


Q5. What’s the key equipments for HDI manufacturing?
Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.


Q6. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.