Shenzhen Yideyi Technology Limited Company 86-136-7006-7254
Rf Pcb Prototype Assembly Electronics Upper Specification Limit Revision Dual In Line Package

Rf Pcb Prototype Assembly Electronics Upper Specification Limit Revision Dual In Line Package

  • High Light

    Rf Pcb Prototype Assembly


    3oz prototype electronics assembly


    3oz Pcb Assembly Pcb Or Prototype Assembly

  • Type
    PCBA Prototype
  • Name
    PCBA Prototype Upper Specification Limit Revision Dual In-Line Package
  • Copper Thickness
  • Shaping
    CNC Routing,Punching,V-CUT, Depth Milling, Castellation
  • Profiling Punching
  • Base Material
  • Usage
    Circuit Board Assembly
  • Min. Line Spacing
  • Place of Origin
  • Brand Name
  • Certification
    ISO13485, IATF16949, ISO9001,IOS14001
  • Model Number
  • Minimum Order Quantity
  • Price
  • Packaging Details
    Vacuum packing or Anti-static package,Outer:export carton or according to the customer's requirement.
  • Delivery Time
    1-10 working days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability

Rf Pcb Prototype Assembly Electronics Upper Specification Limit Revision Dual In Line Package

PCBA Prototype Upper Specification Limit Revision Dual In-Line Package​


Shenzhen Yideyi Technology Co., Ltd is a reliable and leading electronic solutions provider. You can get turnkey solutions for electronic project/product even you just have an idea now.



Turnkey Solutions:


Electronic Design & Development


Solid PCB Manufacturing and Assembly

Cutting-edge Manufacturing

Exceptional Turn Time

Competitive Cost

Consulting of DFM/Design for Manufacturability

DFT/Design for Testability

Confirmation of EMI Control



PCBA Capability

Normal FR4,Normal Tg FR4(Halogen free),High Tg FR4(Halogen free),HDI PCB material
PCB type
Rigid pcb(Backplane,HDI,High multi-layer blind&buried PCB,Embedded Capacitance)
Blind&buried via type,HDI PCB
Finish treatment
Lead free,Leaded,aspect ratio,Max finished size,MIN finished size, PCB thickness, MAX high to gold finger
Plating/coating thickness
Tin thickness,OSP, ENIG, Immersion Silver,Immersion Tin,Hard gold, Soft gold
MAX thickness of mechanical hole 4mil/6mil/8mil,Min/Max laser drilling size,Finshed mechanical hole size
Min Pad size for laser drillings,Min Pad size for mechanical drillings,Min BGA pad size,Pad size tolerance(BGA)
MAX drilling tool size for via filled with Soldermask (single side)
Local mixed pressure
Min gap between mechanical hole wall and conductor (Local mixed pressure area)
Metal substrate PCB
Layer counts,PCB size (Finished),MAX PCB size(Ceramic-substrate PCB),PCB thickness(Finished)
Min space of the V-CUT does not reveal the copper ( Central Line of v-cut to internal/external circuits,H means board thickness)



Trusted and Reliable

Many of our customers have entrusted us to work with them on their NPI/Prototype needs and then to successfully transition those new projects to production volumes.

Our NPI process ensures that your NPI requirements will be managed and built by the same Electronic Solutions Teams and Equipments that will build your production volumes. This allows for a value added process that ensures a high quality and cost effective product for you.

Accountability and superior customer satisfaction is provided by nothing being lost in the transition from the NPI/Prototype process to the higher volume production process.

Rf Pcb Prototype Assembly Electronics Upper Specification Limit Revision Dual In Line Package 0


Rf Pcb Prototype Assembly Electronics Upper Specification Limit Revision Dual In Line Package 1




Q1. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment from POLAR INSTRUMENTS.
The equipment measures the impedance on a representative track configuration coupon of which the client has given us a determinate value and tolerance.


Q2. What kind of PCB file format can you accept for production?


Q3. How do we ensure quality?
Our high quality standard is achieved with the following.
1. The process is strictly controlled under ISO 9001:2008 standards.
2. Extensive use of software in managing the production process
3. State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
4. Dedicated quality assurance team with failure case analysis process
5. Continuous staff training and education


Q4. How can we guarantee you receive an good quality product?

For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.


Q5. What’s the key equipments for HDI manufacturing?
Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.


Q6. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.