Shenzhen Yideyi Technology Limited Company 86-136-7006-7254 elva@ydypcba.com
High Density Interconnect Pcb Hdi Technology 0.06  Diameter Blind   Buried Vias

High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias

  • High Light

    pcb hdi technology

    ,

    high density interconnect pcb

    ,

    high density pcb hdi technology

  • HDI PCB Applications
    Industries Automobiles, Aircraft And Other Vehicles That Rely On Electronics.
  • Name
    HDI PCB Board Laser Drilled Microvias 0.06 Diameter Blind & Buried Vias
  • Quality Grade
    Standard IPC 2
  • Layer
    1~60 Layers
  • Pcb Assembly Process
    SMT THT DIP,DIP. SMT PCB Assembly
  • Surface Finishing
    HASL,OSP,ENIG,HASL Lead Free,immersion Gold
  • Pcb Test
    100% Testing
  • Other Service
    Components Purchasing And Assembly
  • Place of Origin
    China
  • Brand Name
    YDY
  • Certification
    ISO13485, IATF16949, ISO9001,IOS14001
  • Model Number
    HDI1
  • Minimum Order Quantity
    1pcs
  • Price
    $0.1 -$0.3/ 1 piece
  • Packaging Details
    Vacuum packing or Anti-static package,Outer:export carton or according to the customer's requirement.
  • Delivery Time
    1-20 working days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability
    30000pcs/month

High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias

HDI PCB Board Laser Drilled Microvias 0.06 Diameter Blind & Buried Vias

 

 

HDI PCB Board Capabilities include:

 

Laser Drilled Microvias
Sequential Lamination
Stacked Microvias
Blind & Buried Vias
Via-in-Pad
Laser Direct Imaging
.00275" Trace/Space
Fine Pitch (Down to .3mm)



PCB Manufacture Capacity

 

Feature Capability
Service Type

HDI PCB Board Laser Drilled Microvias 0.06 Diameter Blind & Buried Vias

Quality Grade Standard IPC 2
Number of Layers 4 - 48ayers
Order Quantity 1pc - 10000+pcs
Build Time 2days - 5weeks
Material FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination
Board Size Min 6*6mm | Max 457*610mm
Board Thickness 0.4mm - 3.0mm
Copper Weight (Finished) 0.5oz - 2.0oz
Min Tracing/Spacing 2.5mil/2.5mil
Solder Mask Sides As per the file
Solder Mask Color Green, White, Blue, Black, Red, Yellow
Silkscreen Sides As per the file
Surface Finish HASL - Hot Air Solder Leveling
Lead Free HASL - RoHS
ENIG - Electroless Nickle/Immersion Gold - RoHS
Immersion Silver - RoHS
Immersion Tin - RoHS
OSP - Organic Solderability Preservatives - RoHS
Min Annular Ring 4mil, 3mil - laser drill
Min Drilling Hole Diameter 6mil, 4mil - laser drill
Max Exponents of Blind/Buried Vias stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected
Other Techniques Flex-rigid combination
Via In Pad
Buried Capacitor (only for Prototype PCB total area ≤1m²)

 

 

High Quality HDI PCB Manufacturing


HDI PCB designs push the limits of technology and Advanced Circuits is at the forefront of innovation, satisfying the most rigorous requirements.
The demand for HDI PCB manufacturing has been increasing due to the advancements in technology and the many benefits HDI PCBs provide for high-tech applications. Fitting more technology in less space with fewer layers creates limitations for many PCB manufacturers that do not have the specialized equipment and the capacity for advanced features, finer lines, and tighter tolerances. HDI printed circuit board designs utilize a combination of advanced features like microvias, blind vias, via-in-pad, along with stacked and staggered vias to maximize the the space of the board while increasing its performance and functionality.

 

]High quality and precision with in-house laser drill capabilities that include precise depth control. Laser direct imaging (LDI) capabilities ensure exacting registration and all multilayer inner cores receive a thorough check using Automated Optical Inspection (AOI) units for excellent defect detection of the finest features.

 

High Density Interconnect Pcb Hdi Technology 0.06  Diameter Blind   Buried Vias 0

 

 

Shenzhen Yideyi Technology Co., Ltd can provide one-stop service, from the PCB production, the components purchasing to thecomponents assembled.​

 

 

High Density Interconnect Pcb Hdi Technology 0.06  Diameter Blind   Buried Vias 1

 

 
FAQs:
 
1, Do you offer quick turn PCB Assembly ?
Yes, we offer 24 hours quick turn PCB Assembled Solution without sacrifice the quality of the PCB Board.
 
2, Do you offer X-Ray capability ?
Yes, we inspect the boards using X-ray and therefore offer total reliability.
 
3, Do you offer conformal coating service ?
Yes, conformal coating is a part of our value-added services.
 
4, Do you offer testing service ?
Yes, we offer robust functional testing that adds to the product reliability.
 
5, Do you offer IPC 610 or J-STD Quality inspections ?
Absolutely, we offer these inspections as per client requirements.
 
6, Do you offer first article inspection ?
Yes, basis client requirements, we are well equipped to offer first article inspection.
 
7, What is your standard turnatound time for PCB Assembly ?
Our standard turnaround time for PCB Assembly is 3 weeks.