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Multilayer PCB Assembly Service OEM FR4 Surface Mount Smt 0402+QFP

Multilayer PCB Assembly Service OEM FR4 Surface Mount Smt 0402+QFP

Multilayer PCB Assembly Service

PCB Assembly Service OEM

Multilayer Surface Mount PCB Assembly

Place of Origin:


Brand Name:

Sky Win



Model Number:


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Product Details
Material Of PCB:
4 Layers
Board Thickness:
Material Accuracy:
Material Consumption:
253 Pcs
PCB Quality System:
Manufacturing Quality System:
PCB Glod Process:
Immersion Gold
Payment & Shipping Terms
Minimum Order Quantity
100 piece
$0.1- $4.9
Packaging Details
Delivery Time
5-8 days
Payment Terms
L/C, D/A, D/P, T/T
Supply Ability
50000pcs per months
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Product Description

Multilayer PCB Assembly OEM FR4 SMT PCB Assembly PCB Assembly Service 0402+QFP Surface Mount PCB Assembly



SMT PCB Assembly Introduction


SMT is surface mount technology, which is a new generation of electronic assembly technology developed from hybrid integrated circuit technology. SMT PCB assembly refers to a circuit assembly technology that installs SMC/SMD (Chip Components) on the surface of a printed circuit board or other substrate, and sells and assembles it by reflow soldering or dip soldering.


Advantages of SMT

It has a high assembly density, making electronic devices lighter in weight
It has high vibration resistance
SMT ignore reliable
Less solder joint error
SMT has high frequency reduction for electromagnetic and RF reduction
It saves on equipment costs


SMT PCB Assembly Specification

SMT Project name Item MKS BASE V1.4
Manufacturing process SMT patch, DIP Plug in ,AOI test, X-RAY irradiation analysis, CNC panel
Material accuracy 0402+QFN
Number of materials 58 kinds
Material consumption 253 pcs
PCB Glod process Immersion Gold
Number of PCB layers 2 layers
Material FR-4
Board thickness 1.6 mm
Manufacturing quality system IATF16949
PCB quality system ROHS/UL
Application 3D printer
Value-added service 1 year after sale


SMT PCB Assembly Processing Technology requirements for PCB Design
In the process of SMT patch processing, all processing equipment has the characteristics of full automation, precision and speed. Then the PCB design must meet the requirements of SMT patch processing equipment in order to effectively guarantee product quality.

  1. PCB shape design
  2. PCB size design
  3. PCB thickness design
  4. PCB process side design
  5. PCB component layout design
  6. PCB Pad Design

SMT PCB Assembly Characterictics

1. High assembly density
Electronics are small in size and light in weight. Usually, after using SMT, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced by 60% to 80%.

2. High reliability and strong anti-vibration ability
Since SMC and SMD have no leads or short leads, and are firmly attached to the surface of the PCB, they have high reliability and strong vibration resistance. Good high frequency characteristics.

3. It is easy to realize automation and improve production efficiency.
Compared with THT, SMT is more suitable for automatic production. For example, THT needs different plug-in machines (automatic plug-in machines, horizontal plug-in machines, vertical plug-in machines, taping machines, etc.) according to different components.


SMT PCB Assembly Manufacturer


Shenzhen SKY-WIN Technology Co., Ltd which is  one-stop PCBA intelligent manufacturing platform, sample/small batch, SMT patch, PCB proofing, DIP welding processing, PCB board making, full set of electronic components purchasing, one-stop PCBA manufacturing services.





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