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Through-Hole Assembly Multilayer Communication PCB Prototype Printed Circuit Boards

Through-Hole Assembly Multilayer Communication PCB Prototype Printed Circuit Boards

Prototype Printed Circuit Boards

Through-Hole Assembly Printed Circuit Boards

Multilayer Printed Circuit Boards

Place of Origin:

Shen,zhen China

Brand Name:

Sky Win

Certification:

IATF16949

Model Number:

PCBA-T0022

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Product Details
Trademark:
Sky-win PCBA
PCB Assembly Method:
Through-Hole Assembly
Specification:
PCB Customized Size
Base Material:
Copper
Application:
PCB Assembly Manufacturer
Type:
Customizable Communication
Service:
OEM /ODM
Base Material:
FR-4
PCB Layer:
8 Layers
Component Specifications:
LGA BGA QFN
Surface Finishing:
HASL,HASL Lead Free
Solder Mask Color:
Blue.green.red.black.white.etc
Usage:
OEM Electronics
Pcb Assembly Method:
BGA
Payment & Shipping Terms
Minimum Order Quantity
100 piece
Price
$0.1- $4.9
Packaging Details
Carton
Delivery Time
5-8 days
Payment Terms
L/C, D/A, D/P, T/T
Supply Ability
50000pcs per months
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Product Description

Through-Hole Assembly Multilayer Communication PCB Prototype Printed Circuit Boards

 

 

Communication PCB Assembly  Description

 

PCB requirements in the field of communication can be divided into sub-fields such as communication equipment and mobile terminals. Among them, communication equipment mainly refers to the communication infrastructure used for wired or wireless network transmission, including communication base stations, routers, switches, backbone network transmission equipment, microwave transmission equipment, optical fiber to the home equipment

 

Communications PCB Material


Designing the best PCB solution for communications products requires careful selection of substrate laminates, prepregs, conductive layers, coatings and finishes. We use a range of materials specifically tailored to meet the electrical, mechanical and environmental performance standards required for these demanding applications.

 

Communication PCB Assembly Application

 

In the field of communication, communication PCB board is widely used in wireless network, transmission network, data communication. And fixed line broadband. Related PCB products include backboards, high-speed multilayer boards, high-frequency microwave boards, and multifunctional metal substrates.
PCB requirements in the field of communication are divided into subdivisions such as communication equipment and mobile terminals. Communication equipment is a communication infrastructure mainly used for wired or wireless network transmission. Including communication base stations, routers, switches, etc. Communication equipment mainly uses high-rise PCB boards, of which 8-16 layers account for about 42%. The mobile terminal is mainly HDI and flexible board.

 

Communications PCB Parameters​

 

Layer: 8 layers
Surface: HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect.
Copper thickness: 0.25 Oz -12 Oz
Material: FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers
Board thickness 0.1 to 6.0mm(4 to 240mil)
Minimum line width/space 0.076/0.076mm
Minimum line gap +/-10%
Outer layer copper thickness 140um(bulk) 210um(pcb prototype)
Inner layer copper thickness 70um(bulk) 150um(pcb protytype)
Min.finished hole size(Mechanical) 0.15mm
Min.finished hole size (laser hole) 0.1mm
Aspect ratio 10:01(bulk) 13:01(pcb prototype)
Solder Mask Color Green,Blue,Black,White,Yellow,Red,Grey
Tolerance of dimension size +/-0.1mm
Tolerance of board thickness <1.0mm +/-0.1mm
Tolerance of finished NPTH hole size +/-0.05mm
Tolerance of finished PTH hole size +/-0.076mm
Delivery time Mass:10~12d/ Sample:5~7D

 

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                    

Through-Hole Assembly  Multilayer Communication PCB Prototype Printed Circuit Boards 0

 

 

 

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