Shenzhen Yideyi Technology Limited Company 86-136-7006-7254 elva@ydypcba.com
X Ray Reverse Engineering Pcb Boards Copy E Test Motherboard

X Ray Reverse Engineering Pcb Boards Copy E Test Motherboard

  • High Light

    0.5oz x ray reverse engineering pcb boards

    ,

    0.5oz Copy E Test Motherboard

    ,

    X Ray Reverse Engineering Circuit Boards

  • Service
    PCB Reverse Engineering
  • Type
    Copy E-Test Mother Board PCB Reverse Engineering Multilayer PCBA
  • Copper Thickness
    1oz,0.5-2.0 Oz,1oz~3oz,0.5-5 Oz
  • Ionic Contamination
    <1.56ug/cm2(NaCl)
  • Usage
    OEM Electronics
  • Base Material
    FR4 CEM1 CEM3 Ceramic Aluminum
  • Min. Hole Size
    3mil (0.075mm)
  • Application
    Universal
  • Place of Origin
    China
  • Brand Name
    YDY
  • Certification
    ISO13485, IATF16949, ISO9001,IOS14001
  • Model Number
    M-010
  • Minimum Order Quantity
    1pcs
  • Price
    Negotiable
  • Packaging Details
    Vacuum packing or Anti-static package,Outer:export carton or according to the customer's requirement.
  • Delivery Time
    1-20 working days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability
    50000pcs/month

X Ray Reverse Engineering Pcb Boards Copy E Test Motherboard

Copy E-Test Mother Board PCB Reverse Engineering Multilayer PCBA

 

Shenzhen Yideyi Technology Co., Ltd is an expert at PCB and PCBA manufacture, based in Shenzhen, Guangdong, China. We are specialized in manufacturing Single-Sided Boards, Double-Sided Boards and multilayer PCB.

 

Reverse engineering is applicable in the fields of computer engineering, mechanical engineering, electronic engineering, software engineering, chemical engineering and systems biology.

There are many reasons for performing reverse engineering in various fields. Reverse engineering has its origins in the analysis of hardware for commercial or military advantage. However, the reverse engineering process, as such, is not concerned with creating a copy or changing the artifact in some way. It is only an analysis to deduce design features from products with little or no additional knowledge about the procedures involved in their original production.[

In some cases, the goal of the reverse engineering process can simply be a redocumentation of legacy systems.

 

Software reverse engineering can help to improve the understanding of the underlying source code for the maintenance and improvement of the software, relevant information can be extracted to make a decision for software development and graphical representations of the code can provide alternate views regarding the source code, which can help to detect and fix a software bug or vulnerability. Frequently, as some software develops, its design information and improvements are often lost over time, but that lost information can usually be recovered with reverse engineering. The process can also help to cut down the time required to understand the source code, thus reducing the overall cost of the software development.

 

Reverse engineering can also help to detect and to eliminate a malicious code written to the software with better code detectors.

 

 

There are other uses to reverse engineering:

 

Interfacing. Reverse engineering can be used when a system is required to interface to another system and how both systems would negotiate is to be established. Such requirements typically exist for interoperability.

Military or commercial espionage. Learning about an enemy's or competitor's latest research by stealing or capturing a prototype and dismantling it may result in the development of a similar product or a better countermeasure against it.

Obsolescence. Integrated circuits are often designed on proprietary systems and built on production lines, which become obsolete in only a few years. When systems using those parts can no longer be maintained since the parts are no longer made, the only way to incorporate the functionality into new technology is to reverse-engineer the existing chip and then to redesign it using newer tools by using the understanding gained as a guide. Another obsolescence originated problem that can be solved by reverse engineering is the need to support (maintenance and supply for continuous operation) existing legacy devices that are no longer supported by their original equipment manufacturer.

Saving money. Finding out what a piece of electronics can do may spare a user from purchasing a separate product.

Repurposing. Obsolete objects are then reused in a different-but-useful manner.

 

 

Why Use Our PCB Reverse Engineering Service?

 

Our Reverse Engineering Services are designed + developed in accordance with what you want and need. These services are widely appreciated by our clients for their timely execution and genuine prices.

 

1. Manufactured items are frequently smaller + more efficient — saving you space, time, + costs.

 

2. All reverse engineering projects use only modern + current components making any future repairs they may need easier + cost effective.

 

3. Most units are upgradeable — we can add functionality, outputs, sensors, or change programs slightly to broaden your processing capability and to improve operations, maintenance + support issues on older circuit Boards

 

4. Migration from through hole parts to SMD (Surface Mount Device) parts

 

5. Migration to emerging technologies while retaining the core features and logic of existing systems

 

6. Discover product strengths, weaknesses and limitations

 

7. To understand competitor's products and develop alternatives

 

8. Manufacturer of a product no longer exists or produces a product

 

9. Manufacturer of a product no longer supports/services a product

 

10. Documentation of the original design is lost or inadequate

 

11. To update obsolete components with current technology

 

12. Create better designs

 

 

PCB Reverse Engineering Services

We will reverse engineer your PCB sample, and submit the engineering file into:

 

PCB Gerber File

BOM List

Schematic Diagram

 

 

YDY service:

 

1. PCBA, PCB assembly: SMT & PTH & BGA

2. PCBA and enclosure design

3. Components sourcing and purchasing

4. Quick prototyping

5. Plastic injection molding

6. Metal sheet stamping

7. Final assembly

8. Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)

9. Custom clearance for material importing and product exporting

10. PCBA reverse engineering

11. Professtional R&D team

12. PCB Layout Design

 

 

 

PCB Assembly Manufacturing Procedures:

 

Program Management

 

PCB Files → DCC → Program Organizing → Optimization → Checking

 

SMT Management

PCB Loader → Screen Printer → Checking → SMD Placement → Checking → Air Reflow → Vision Inspection → AOI → Keeping

 

PCBA Management

THT→Soldering Wave (Manual Welding) → Vision Inspection → ICT → Flash → FCT → Checking → Package → Shipment

 

 

Each board is carefully examined by our dedicated inspection team using AOI and high magnification viewers.

Using our X-Ray machine, we test PCBs to component level and all wiring is fully inspected and tested. Flash

testing and earth bonding tests can also be undertaken where required

 

 

 

PCB SMT Manufacture Capacity

 

 
Specifications
Details

Material Type

FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont

Material Thickness

Min. thickness: 0.4mm(16mil)
Max. thickness: 3.2mm(128mil)

Layer count

1 to 28 Layers

Max. Board Size

23.00" x 35.00"(580mm*900mm)

IPC Class

Class II, Class III , Class 1

Annular Ring

5 mil/side or Greater (Min. Design)

Finish Plating

Solder(HASL), Lead Free Solder(HASL), ENIG (ELectroless Nickel Immersion Gold), OSP, Immersion Silver,Immersion Tin, Immersion Nickel, Hard Gold, Other

Copper Weight

0.5OZ-7OZ

Trace/Space Width

3 Mils or Greater

Drill Clearance

0.1mm(laser drilling)

Plated Slots

0.036 or Greater

Smallest Hole (Finished)

0.1mm or Greater

Gold Fingers

1 to 4 Edge (30 to 50 Micron Gold)

SMD Pitch

0.080" - 0.020" - 0.010"

Soldermask Type

LPI Glossy, LPI-Matte, SR1000

Soldermask Color

Green, Red, Blue, Black, White, Yellow,

Legend Color

White, Yellow, Black, Red, Blue

CNC Route Point

Any

Minimum Route Width

0.031"

Scoring

Straight Lines, Jump Scoring, Panel Edge to Edge, CNC*

Body Gold

HARD*, IMMERSION* (up to 50 MICRON GOLD)

Data File Format

Gerber 274x with embedder aperture

Fab. Drawing Format

DXF, HPGL, DWG, PDF, Gerber

E.T Testing

Flying Probe, Single Sided, 1up Plate, Clampshell, Net List

Counter Sink / Counter Bore

Availiable up to 0.250 Diameter

 

X Ray Reverse Engineering Pcb Boards Copy E Test Motherboard 0

 

X Ray Reverse Engineering Pcb Boards Copy E Test Motherboard 1

 

 

 

High quality and on-time delivery is always our promise:

 

X Ray Reverse Engineering Pcb Boards Copy E Test Motherboard 2

 

 

 

FAQ:

 

Q1. How to keep our product information and design file secret ?
We are willing to sign a NDA effect by customers side local law and promising to keep customers data in high confidential level.


Q2. How long does it take for PCB and PCBA Quote ?
PCBs quotation within 2 hours can finished the PCBA depend on the components
quantity,if simple, within 6 hours can finished,once complex and more,the 12- 36 hours
can be finished.


Q3. Please note that the following detail will speed up evaluation:
Material:
Board thickness:
Copper thickness:Surface finish:
Solder mask color:
Silkscreen color:

 

Q4. How to make sure the PCBAs are completely well recieved?
We will pack with aluminum bag, and insert card, up and bottom card with stable cartons.

Q5. How to ship the PCBAs?
For small packages, we will ship the boards to you by DHL,UPS,FEDEX,TNT. Door to door service! For mass production, we could ship by air, by sea.