Shenzhen Yideyi Technology Limited Company 86-136-7006-7254
12oz Multilayer Quick Turn Flex Pcb Board High Volume Pcb Manufacturing

12oz Multilayer Quick Turn Flex Pcb Board High Volume Pcb Manufacturing

  • High Light

    12oz Quick Turn Flex Pcb Board


    12oz Multilayer Flex Pcb


    Aluminum PCB Board

  • Service
    24Hours Technical Services
  • Type
    12oz Aluminum-Based Board Quick Turn Prototype Rigid Flexible PCB
  • Surface
    HASL Lf/Enig/OSP
  • Copper Thickness
  • Min. Line Width
  • Min BGA Pitch
    4mil (0.1mm)
  • Layer
    Double Layer FPC
  • Hole Tolerance
    PTH: +/-3mil NPTH: +/-2mil
  • Place of Origin
  • Brand Name
  • Certification
    ISO13485, IATF16949, ISO9001,IOS14001
  • Model Number
  • Minimum Order Quantity
  • Price
  • Packaging Details
    Vacuum packing or Anti-static package,Outer:export carton or according to the customer's requirement.
  • Delivery Time
    1-15 working days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability

12oz Multilayer Quick Turn Flex Pcb Board High Volume Pcb Manufacturing

12oz Aluminum-Based Board Quick Turn Prototype Rigid Flexible PCB



We can offer:


◆ One stop service

◆ Quality Management

◆ Final Control And Inspection

◆ NDA protection

◆ 100% functional testing

◆ Bom Gerber Files PCBA

◆ SMT Assembly, labeling and packging the boards or system according to the customer's packaging requirements

◆ Lifetime warranty

◆ ESD-safe work environment

◆ Pcba Design

◆ PCBA full copy



Rigid Flexible PCB Capability


Process capability
product type
FR-4, High Tg, Aluminium, Copper PCB, Ceramic PCB, Polyimide PCB, Rigid-flex PCB
Max layer count
20 layers
Min base copper thickness
1/3 OZ (12um)
Max finished copper thickness
10 OZ (350um)
Min trace width/spacing(Inner layer)
2/2mil (0.05mm)
Min trace width/spacing(Outer layer)
2/2mil (0.05mm)
Min spacing between hole to inner layer conductor
6mil (0.15mm)
Min spacing between hole to outer layer conductor
6mil (0.15mm)
Min annular ring for via
4mil (0.1mm)
Min annular ring for component hole
4mil (0.1mm)
Min BGA diameter
4mil (0.1mm)
Min BGA pitch
4mil (0.1mm)
Min hole size
0.15mm(CNC); 0.1mm(Laser)
Max aspect ratios
Min soldermask bridge width
4mil (0.1mm)
Soldermask/circuit processing method
Min thickness for insulating layer
1mil (0.025mm)
HDI & special type PCB
HDI(1-3 steps), R-FPC(2-16 layers), High frequency mix-pressing(2-14 layers), Buried capacitance & resistance, 0.14mm to 0.2mm
extra thinner pcb,high heat conducting thermoelectric separation copper based pcb, etc
Surface treatment type
ENIG, HAL, HAL lead free, OSP, Immersion Sn, mmersion silver, Plating hard gold,Plating silver, carbon oil, ENIG immersion tin
Max PCB size
Multi-layer: 600*550mm 1-2 layer: 500*1200MM



What are Rigid-Flex PCB's?


Rigid-Flex PCB’s are made by the combination of rigid and flexible PCB’s, hence they have characteristics of both types of PCB’s. A rigid PCB is connected to a flexible PCB integrated together through a strong electrical connection. Flexible boards consist of multiple layers of flexible substrates that are connected to each other by internal or external circuitary. Rigid-Flex PCB Boards are sort of a hybrid with parts of the PCB being Rigid and other parts being flexible based on the application or requirement. The circuit boards can be developed to be rigid where extra support is needed and flexible where they circuit might need to be bent.


Rigid-Flex Features:

1 – 20+ Layers Capability
IPC 6013 types 1, 2, & 3
Complex balanced & unbalanced structures
Custom Surface Finishes Available


Rigid-Flex PCB manufactured are wildly used on many industries, such as Industrial control, MCU control , Smart Home , Tele-communication , Automobile ,Programming control, Wireless ,Medical ,LED control and Consumer Electronics.


12oz Multilayer Quick Turn Flex Pcb Board High Volume Pcb Manufacturing 0


YDY provides a comprehensive set of services that enable companies, from start-UPS to multinationals, successfully innovate, create, and gain access to new markets. We offer extensive knowledge of industries and the disruptive technology within businesses that can help you pilot your product and achieve the visibility you need to be competitive.


12oz Multilayer Quick Turn Flex Pcb Board High Volume Pcb Manufacturing 1



Shenzhen Yideyi Technology Co., Ltd strives to be your one stop solution partner in EMS supply chain, including PCB design , PCB fabrication and PCBassembly (PCBA).We provide some of the most advanced PCB technology, including HDI PCBs,multilayer PCBs, Rigid-Flexible PCBs.Wecan support from quick turn prototype to medium & mass Production.

In general, our customers are very impressed with our services:rapid response, competitive price and quality commitment.





Q1. How to keep our product information and design file secret ?
We are willing to sign a NDA effect by customers side local law and promising to keep customers data in high confidential level.


Q2. What kind of PCB file format can you accept for production?


Q3. How do we ensure quality?
Our high quality standard is achieved with the following.
1. The process is strictly controlled under ISO 9001:2008 standards.
2. Extensive use of software in managing the production process
3. State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
4. Dedicated quality assurance team with failure case analysis process
5. Continuous staff training and education


Q4. How can we guarantee you receive an good quality product?

For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.


Q5. What’s the key equipments for HDI manufacturing?
Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.


Q6. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.