Shenzhen Yideyi Technology Limited Company 86-136-7006-7254 elva@ydypcba.com
2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly

2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly

  • High Light

    2 Layer Pcb Design

    ,

    6 Layer Motherboard Pcb Design

    ,

    6 Multilayer Pcb Design

  • Name
    1-18Layers High Speed Digital Electronics PCB Design Single/Double PCBA
  • Min. Line Width
    0.1 0mm
  • Surface Finishing
    ENIG,OSP
  • Copper Thickness
    1~2oz
  • Item
    DGW-1
  • Application
    Prototype PCB
  • Color
    Green/Blue/Red/White/Yellow/Black
  • Base Material
    Copper Core
  • Place of Origin
    China
  • Brand Name
    YDY
  • Certification
    ISO13485, IATF16949, ISO9001
  • Model Number
    P-013
  • Minimum Order Quantity
    1pcs
  • Price
    Negotiatable
  • Packaging Details
    Anti-static bag + white pearl cotton (used around the inside of the carton) + carton
  • Delivery Time
    1-5 working days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability
    100000/month

2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly

1-18Layers High Speed Digital Electronics PCB Design Single/Double PCBA

 

 

We provide one-stop PCB/PCBA customization services:

 

1. To offer good quality PCB/PCBA to our customer, we will do many kind of testing to ensure quality before shipment
2. Outgoing test to check min PTH Cu thickness, Min surface Cu thickness, ENIG Au data,Ni data, Au layer adhesion testing, soldermask adhesion testing, silkscreen adhesion testing, Thermal stress testing, hardness testing, Twist testing, Bow testing
3. Microsection testing to check hole Cu thickness, Surface Copper thickness, Wrap copper thickness, Hole Wall Integrity, soldermask thickness and stack up.
4.  E-test to check any open/short circuit.
5. Thermal Stress Test to avoid any Delamination, Measling and others.
6. Solderability of PTH to avoid any discolor, Wrinkles, Blisters, Measling, Blow-Hole, Solermask peel off, and soldermask filled in hole-wall incompletely.

 

 

PCB capability:

 

Item Specification  
1 Numbr of Layer 1-18Layers
2 Material FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate
3 Surface Finish HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek)
4 Finish Board Thickness 0.2mm-6.00 mm(8mil-126mil)
5 Copper Thickness 1/2 oz min;12 oz max
6 Solder Mask Green/Black/White/Red/Blue/Yellow
7 Min.Trace Width & Line Spacing 0.075mm/0.1mm(3mil/4mil)
8 Min.Hole Diameter for CNC Driling 0.1mm(4mil)
9 Min.Hole Diameter for punching 0.9mm(35mil)
10 Biggest panel size 610mm*508mm
11 Hole Positon +/-0.075mm(3mil) CNC Driling
12 Conductor Width(W)

0.05mm(2mil)or;

+/-20% of original artwork

13 Hole Diameter(H)

PTH L:+/-0.075mm(3mil);

Non-PTH L:+/-0.05mm(2mil)

14 Outline Tolerance

0.125mm(5mil) CNC Routing;

+/-0.15mm(6mil) by Punching

15 Warp & Twist 0.70%
16 Insulation Resistance 10Kohm-20Mohm
17 Conductivity <50ohm
18 Test Voltage 10-300V
19 Panel Size 110×100mm(min);660×600mm(max)
20 Layer-layer misregistration

4 layers:0.15mm(6mil)max;

6 layers:0.25mm(10mil)max

21 Min.spacing between hole edge to circuity pqttern of an inner layer 0.25mm(10mil)
22 Min.spacing between board oulineto circuitry pattern of an inner layer 0.25mm(10mil)
23 Board thickness tolerance

4 layers:+/-0.13mm(5mil);

6 layers:+/-0.15mm(6mil)

24 Impedance Control +/-10%
25 Different Impendance +-/10%


 

We form close working relationships between Electronics Engineers, Designers, Bare Board Manufacturers, and together with our own in house Test and Assembly facilities. Identify problem areas before they become an issue. Make recommendations that could possibly increase manufacturing or assembly yields on volume product.This approach shortens the design cycle, reducing the time to market, which in turn reduces the overall cost of a project, leading to a more cost effective product.

 

2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly 0

 

If you don't have a circuit or any PCB data. We can reverse engineer most bare PCB’s and provide you with up to date schematic diagrams and PCB design data.

 

2 4 6 Layer Motherboard Pcb Design For Manufacturing Electronic Pcb Assembly 1

 

 

Shenzhen Yideyi Technology Co., Ltd is an advanced technology company specialized in researching & developing, designing and manufacturing all types of intelligent control panels and controllers. We implement electronic product designs, industrial system automation designs, electronic circuit hardware and software designs and others while fulfilling OEM/ODM purchase orders. Our main focus is on R&D and technically-driven electronics manufacturing services (EMS).


 

 

FAQ:

 

Q1. How can we ensure our information should not let third party to see our design?
We are willing to sign NDA effect by customer side local law and promising to keep customers date in high confidential level in all projects.


Q2. What service do you have?
We provide turnkey solution including RD, PCB fabrication, SMT, final assembly,testing and other value-added service.


Q3. Please note that the following detail will speed up evaluation:
Material:
Board thickness:
Copper thickness:Surface finish:
Solder mask color:
Silkscreen color:

 

Q4. How about the delivery?
Normally, for sample order, our delivery is about 5 days.For small batch, our delivery is about 7 days.
For mass production batch, our delivery is about 10 days.
But that depends on the real condition when we get your order.
If your order is urgently please contact us directly ,we will priority to deal it and do ourbest to give you satisfied delivery time.

 

Q5. With payment terms do we accept?
For sample order or small batch, we suggest you to use Pay-pal and Western Union.For mass production batch, we suggest you to use T/T.

 

Q6. How can we guarantee you receive an good quality product?
For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.