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4 Layers Pcb Board Assembly Thickness 1.0mm Pcb Smt Assembly

4 Layers Pcb Board Assembly Thickness 1.0mm Pcb Smt Assembly

4 Layers Pcb Board Assembly

4 Layers Pcb Smt Assembly

1.0mm Pcb Smt Assembly

Place of Origin:


Brand Name:

Sky Win



Model Number:


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Product Details
Material Of PCB:
PCB Board Thickness:
1.0 Mm
Material Accuracy:
0402+CO2 Sensor
Material Consumption:
43 Pcs
PCB Surface:
Double-Sided Boards
Manufacturing Quality System:
4 Layers
PCB Process:
Immersion Glod
Application Field:
Air Detector, Temperature And Humidity Meter, Internet Of Things
Payment & Shipping Terms
Minimum Order Quantity
100 piece
$0.1- $4.9
Packaging Details
Delivery Time
5-8 days
Payment Terms
L/C, D/A, D/P, T/T
Supply Ability
50000pcs per months
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Product Description

4 Layers SMT PCB Assembly PCBA Prototype Internet Of Things Black Soldmask With Board Thickness 1.0mm



Description of process for SMT PCB Assembly

SMT PCB assembly procedures usually include solder paste printing, chip installation, reflow soldering, AOl, X-ray and rework. A visual inspection is performed after each step of the program.


SMT PCB Basic Process Components


Silk Screen



Reflow soldering,





SMT PCB Assembly Specification


SMT Project name Item SUB P5 PCBA
Manufacturing process SMT, AOI test,X-RAY irradiation analysis,CNC panel
Material accuracy 0402+CO2 sensor
Number of materials 43 kinds
Material consumption 109  pcs
PCB process Immersion Glod
Number of PCB layers 4 layers
PCB Surface Double-Sided Boards
Material FR-4
Board thickness 1.0 mm
Manufacturing quality system IATF16949
PCB quality system ROHS/UL
Application Field Air detector, temperature and humidity meter, Internet of Things


SMT PCB Assembly Manufacturer


Shenzhen SKY-WIN Technology Co., Ltd  was founded in February 2015, focusing on PCBA OEM/ODM one-stop service, solution customization, SMT patch, DIP plug-in, functional testing, assembly and other OEM/ODM services.


SMT PCB Assembly Inspection Necessity

In order to ensure the quality and performance of the assembled PCB, it is very necessary to check during the entire SMT assembly process. Multiple types of inspections must be used to reveal manufacturing defects, which can reduce the reliability of the final product.

Visual inspection is most commonly used in SMT patch assembly. As a direct inspection method, visual inspection can be used to indicate obvious physical errors, such as component displacement, missing components, or component irregularity.

Visual inspection is not suitable for visual inspection. Tools such as a magnifying glass or microscope can also be used. In order to further point out the defects occurring in the welding ball, AOI and X-ray inspection can be used after the completion of coal bonding


SMT PCB Assembly Case


4 Layers Pcb Board Assembly Thickness 1.0mm Pcb Smt Assembly 04 Layers Pcb Board Assembly Thickness 1.0mm Pcb Smt Assembly 1




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