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Custom Electronic FR4 Multilayer SMT PCB Assembly Prototype Black White Silk Screen

Custom Electronic FR4 Multilayer SMT PCB Assembly Prototype Black White Silk Screen

FR4 Multilayer SMT PCB Assembly

Prototype SMT PCB Assembly

Place of Origin:


Brand Name:

Sky-Win Technology



Model Number:


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Product Details
Product Type:
SMT PCB Assembly
Surface Finish:
Board Thickness:
Solder Mask Color:
Solder Mask:
FR4 CEM1 CEM3 Hight TG
PCBA Circuit Board
Copper Thickness:
0.25 Oz -12 Oz
Factory SMT Pcb Assembly
Payment & Shipping Terms
Minimum Order Quantity
100 piece
$0.1- $4.9
Packaging Details
Delivery Time
Payment Terms
T/T, D/A, D/P
Supply Ability
1000pcs per months
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Product Description

Custom Electronic SMT FR4 Multilayer PCBs Prototype Black White Silk Screen PCB Assembly


SMT Stencil Used In The PCB Design

Surface Mount Technology (SMT) templates are made of a thin, flexible material with openings corresponding to the pads of the components and holes in the PCB. The opening in the template allows conductive ink to flow during PCB etching. They are a great way to quickly and accurately apply solder paste to the pad on the circuit board. PCB templates help save money, improve quality and speed up the manufacturing process. Templates can be used for single or multi-layer boards, as well as multi-layer large boards. At Sky Win, we offer a wide range of rugged SMT Stencils to suit your specific manufacturing needs, manufacturing methods and components used in your board.


SkyWin SMT Assembly Capability

We have the capabilities to assemble SMT prototype PCBs in small production runs with manual and/or automated SMT production processes, including single- or double-sided component insertions. Our production facilities can assemble the following SMT types:
Ball Grid Array (BGA)
Ultra-Fine Ball Grid Array (uBGA)
Quad Flat Pack No-Lead (QFN)
Quad Flat Package (QFP)
Small Outline Integrated Circuit (SOIC)
Plastic Leaded Chip Carrier (PLCC)
Package-On-Package (PoP)
Small Chip Packages (0.2mm pitch )
Main SMT Machines in PCBWay
Automatic Solder Paste Printer
Reflow Soldering Machine
Pick & Place Machine

Manufacturing Capabilities: PCB Assembly Manufacturer, Solder Paste Printing, Reflow Soldering, AOI, and X-ray Inspection


SMT PCB Assembly Technical Parameters 


Product Name PCB & PCBA
Material FR4, CEM1, CEM3, High Frequency Board,
Layer 1,2,4,6...20Layer
Shape Retangular, Round, Slots, Cutouts, Complex, Irregular
Cutting Shear, V-score, Tab-routed
Board Thickness 0.2-4mm, regular 1.6mm
Copper Thickness 0.5-4oz, regular 1oz
Solder Mask Green, Red, Blue, Yellow, etc.
Silk Screen White, Black, etc.
Silk Screen Min Line Width 0.006" or 0.15mm
Min Trace/Gap 0.1mm or 4mils
Min Drill Hole Diameter 0.01",0.25mm or 10mils
Surface Finish HASL, ENIG, OSP, etc.


SMT PCB Assembly Capacity:


Items PCBA capacity
Product name SMT circuit board manufacturer custom electronic assembly pcb pcba
Assembly details SMT and Thru-hole, ISO SMT and DIP lines
Testing on products Testing jig/mold , X-ray Inspection, AOI Test, Functional test
Quantity Min quantity : 1pcs. Prototype, small order, mass order, all OK
Files needed PCB : Gerber files(CAM, PCB, PCBDOC)
Components : Bill of Materials(BOM list)
Assembly : Pick-N-Place file
PCB Panel Size Min size : 0.25*0.25 inches(6*6mm)
Max size : 1200*600mm
Components details Passive Down to 0201 size
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine BGA Pitch to 0.2mm(8mil)
BGA Repair and Reball
Part Removal and Replacement
Component package Cut Tape, Tube, Reels, Loose Parts
PCB+ assembly process Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity


SMT PCB Assembly Manufacturer


Shenzhen SKY-WIN Technology Co., Ltd was founded in February 2015, focusing on PCBA OEM/ODM one-stop service, solution customization, SMT patch, DIP plug-in, functional testing, assembly and other OEM/ODM services.


SMT PCB Assembly Inspection Necessity

In order to ensure the quality and performance of the assembled PCB, it is very necessary to check during the entire SMT assembly process. Multiple types of inspections must be used to reveal manufacturing defects, which can reduce the reliability of the final product.

Visual inspection is most commonly used in SMT patch assembly. As a direct inspection method, visual inspection can be used to indicate obvious physical errors, such as component displacement, missing components, or component irregularity.

Visual inspection is not suitable for visual inspection. Tools such as a magnifying glass or microscope can also be used. In order to further point out the defects occurring in the welding ball, AOI and X-ray inspection can be used after the completion of coal bonding


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