The 11th China (Western) Electronic Information Expo, SKY-WIN Technology and You Meet Chengdu

The China (Western) Electronic Information Expo has entered its eleventh year and has developed into a large-scale, comprehensive industrial chain, and rich activity event with international influence in the western region.

The 11th China (Western) Electronic Information Expo was launched from July 13 to 15, 2023 at the Chengdu Century City New International Convention and Exhibition Center, with the establishment of the Digital Industry Hall and the Basic Electronics Hall, which will showcase the new development achievements and application scenarios of the electronic information industry in the western region.

Mr. Lau the founder of Shenzhen SKY-WIN Technology Co., Ltd., as a Sichuan native who has been drifting deeply for 18 years, accompanied the company team to receive a review from fellow villagers at Hall 8 3C101;

Shenzhen SKY-WIN Technology Co., Ltd. was established in February 2015, specializing in OEM/ODM one-stop services such as PCBA solution customization, PCBA OEM materials, SMT chip processing, DIP plug-in post welding, testing and assembly.

Since its establishment, the company has successively passed ISO9001, IATF16949 quality management system certification, and national high-tech enterprise certification, and has received unanimous praise from many customers. It has also been awarded the title of "Excellent Supplier" multiple times.

SKY-WIN company has 7 fully automatic SMT production lines and 1 wave soldering production line, a constant temperature, humidity, and dust-free workshop, with complete supporting equipment, fully meeting the requirements of rapid delivery and reliable quality for trial production sampling, large, medium, and small batch order production; Received recognition and cooperation from numerous customers in fields such as automotive electronics, industrial control electronics, medical electronics, and new energy;

PCBA Service Display Scope

1. PCBA one-stop manufacturing service project: solution customization+full set material procurement+SMT+DIP+testing and assembly;
2. Solution customization service process: schematic design+software development+PCB layout;
3. BOM allocation service process: PCB manufacturing+electronic material procurement+domestic substitution;
4. Manufacturing service process: SMT+DIP+AOI+X-Ray irradiation analysis+functional testing+CNC panel splitting+three proofing paint spraying+assembly packaging;
5. Process: lead-free and environmentally friendly;
6. Quality assurance: Fully implement and certify the IATF16949 quality system;
7. PCBA processing capacity: hard board+soft board+soft hard combination board, with a daily production capacity of 1000W chips;
8. PCB size: width * 50MM small, length * 400MM long;
9. Material accuracy: * Small package 01005+* Small BGA spacing 0.3MM;
10. Manufacturing service fields: industrial control, medical equipment, Internet of Things, smart home, communication equipment, automotive electronics, new energy;
11. After sales service: one year.