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Customized Size Communication Printed Circuit Board Assembly With Mixed BGA SMT Through Hole PCB Assembly

Customized Size Communication Printed Circuit Board Assembly With Mixed BGA SMT Through Hole PCB Assembly

Communication Printed Circuit Board Assembly

Through Hole Printed Circuit Board Assembly

Place of Origin:

Shenzhen,China

Brand Name:

Sky-Win Technology

Certification:

IATF16949

Model Number:

PCB T-0506

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Product Details
Pcba Product Name:
4G Communication/Network Switch
Specification:
PCB Customized Size
Pcb Request:
Gerber&BOM
Material Of Pcb:
FR-4
Base Material:
Aluminum,CEM-1
Surface Finishing:
HASL,OSP,ENIG,HASL Lead Free,Immersion Gold
Product Name:
Assembly For Circuit Board
Type:
Printing Circuit Board
Application:
Industry/Medical/Consumer Electronic
Usage:
OEM Electronics
Pcb Test:
Flying-Probe PCB Test
Pcb Assembly Method:
Mixed,BGA,SMT,Through-hole
Payment & Shipping Terms
Minimum Order Quantity
100 piece
Price
$0.1- $4.9
Packaging Details
Carton
Delivery Time
5-10 working days
Payment Terms
L/C, D/A, D/P, T/T
Supply Ability
100000 pcs
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Product Description

Customized Size Communication Printed Circuit Board Assembly With Mixed,BGA/SMT/Through-Hole PCB Assembly Method

 

 

The Role of PCB Assembly in Advancing Communication Technology

 

Communication plays an essential role in this interconnected world. Advanced communication technologies depend on intricate electronics to work efficiently.From cell phones, satellites, internet routers, and communication equipment,PCB assembly serves as a foundation for the modern technology which allows seamless connectivity and revolutionizes our interactions as well as information sharing.

This article will analyze the pivotal role of PCB assembly and how it supports development and connection in the communication sector.

 

Communication PCB Assembly Features

 

Relying on PCB assembly for communication offers many advantages.

First, the compact and efficient design allows for integrating complex components into a small area. This in turn enables the development of smaller communication devices, such as smartphones or routers, without compromising functionality or performance.

Second, proper signal routing, impedance matching, and noise control are essential for maintaining signal integrity and achieving reliable and high-quality data transmission. This is ensured by the advanced PCB assembly technology which helps reduce signal loss, distortion, and interference.

In addition, the technology also allows for high-density packaging of electronic components, which results in miniaturized communication devices and efficient use of space.

Last but not least, PCB assembly also offers cost advantages such as lower production costs per unit and faster automated assembly processes like surface mount technology (SMT). Moreover, industry-standard design and manufacturing processes and quality control measures help to ensure product quality and customer satisfaction.

 

Communication PCB Assembly Parameters

 

Category Communications PCB Assembly
PCB Material FR-4
PCB Thickness 1.2mm
Copper Thickness 2OZ
Specialist High TG
PCB Surface treatment Immersion Gold
Solder Mask Black
Silkscreen White
Quality Standard IPC Class 2, 100% E-testing
Additional Process Protective Coating
PCB quality system ROHS/UL
Application Segment E-paper book/4G Communication/Network Switch
Request File PCB: Gerber files(CAM, PCB, PCBDOC)
Components: Bill of Materials(BOM list)
 

 

Applications Communication PCB Assembly

 

Wireless communication technology has become increasingly important in our lives, providing us with connectivity and convenience while we are on the move. PCB assembly is essential in enabling a variety of wireless communication modules, such as Wi-Fi, Bluetooth, NFC, and 5G, to work at required data rates and low latency.

The proliferation of the Internet of Things (IoT) has seen smart devices gain widespread adoption. To enable them to effectively collect, process, and transmit data, PCB assembly is used for flawless communication and efficient functioning. This technique is used in areas such as smart homes, wearable gadget technology, and industrial IoT applications.

 

Customized Size Communication Printed Circuit Board Assembly With Mixed BGA SMT Through Hole PCB Assembly 0Customized Size Communication Printed Circuit Board Assembly With Mixed BGA SMT Through Hole PCB Assembly 1

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