Communication PCB Assembly

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Communication PCB Assembly

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16 Layers Communication PCB Assembly

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2OZ Multilayer Circuit Board

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HDI Multilayer Printed Circuit Board

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ODM Electronics Communication PCB Assembly Immerison Gold Printed Circuit Board

Category: Communications PCB

Surface Finishing: HASL,OSP,ENIG,HASL Lead Free,Immersion Gold

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High Frequency Printed Circuit Board Assembly For Wireless Communication

Application Field: Communication

Solder Mask: Green/black/white/red/blue Etc.

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OEM Electronics Communication PCB Assembly Green Smt Pcb Manufacturer

Category: Communications PCB

Surface Finishing: HASL,OSP,ENIG,HASL Lead Free,Immersion Gold

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Double Sided SMT Printed Circuit Board Green 4 Layer One Stop Service

Category: Communications PCB

Surface Finishing: HASL,OSP,ENIG,HASL Lead Free,Immersion Gold

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High Reliability Communication PCB Assembly SMT Prototype PCB Fabrication

Application Field: Communication

Solder Mask: Green/black/white/red/blue Etc.

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Copper Prototype PCB Fabrication 1OZ Through Hole Pcb Assembly

Base Material: FR-4

Application Field: 5G Communication

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Through Hole Communication PCB Assembly Printed Circuit Board Thickness 1.0mm

Surface Finishing: HASL,OSP,ENIG,HASL Lead Free,Immersion Gold

Material Accuracy: 0402+BGA0.5MM

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Double Sided Pcba Printed Circuit Board Blue Pcb Board Manufacturer

Base Material: FR-4

Surface Finishing: HASL,OSP,ENIG,HASL Lead Free,Immersion Gold

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IATF16949 Communication PCB Assembly Blue Electronic Circuit Board

Base Material: FR-4

Surface Finishing: HASL,OSP,ENIG,HASL Lead Free,Immersion Gold

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6 Layers Turnkey Pcb Assembly Prototype For 4G AI Android Smart Module

Application Field: Automatic DriveReader, E-paper Book, Tablet With 4G Communication Function

Material Accuracy: Passive Device 0201 BGA Spacing 0.35MM Pitch

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SMT Communication PCB Assembly Electronic Pcba Printed Circuit Board

Product Name: Communication PCB Assembly

PCBA Service: SMT+4G Calibration + Functional Testing

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Customized Size Communication PCB Assembly with FR-4 Material and SMT DIP Method

Min. Hole Size: 0.2mm

Min. Silkscreen Line Width: 0.15mm

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0.2mm Min. Trace Spacing FR4 Green Solder mask Communication Printed Circuit Board Assembly for ROHS System

Application: Communication PCB Assembly

Production Capacity: 500000 Square/Year

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Quick Turn Communication PCB Assembly Electronic 6 Layers PCB High Tg170 and High Tg180 Boards

Trademark: Sky-win PCBA

Solder Mask: Green/black/white/red/blue Etc.

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Through-Hole Assembly Multilayer Communication PCB Prototype Printed Circuit Boards

Trademark: Sky-win PCBA

PCB Assembly Method: Through-Hole Assembly

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Rigid Multilayer CEM3 Quick Turn Communication PCB Assembly Electronic Card 1.6mm Thick

Trademark: Sky-win PCBA

Solder Mask: Green/black/white/red/blue Etc.

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