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Copper Prototype PCB Fabrication 1OZ Through Hole Pcb Assembly

Copper Prototype PCB Fabrication 1OZ Through Hole Pcb Assembly

Copper Prototype PCB Fabrication

Copper Through Hole Pcb Assembly

1OZ Through Hole Pcb Assembly

Place of Origin:


Brand Name:

Sky Win



Model Number:


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Product Details
Base Material:
Application Field:
5G Communication
Solder Mask:
Green/black/white/red/blue Etc.
PCB Assembly Method:
High Reliability And Precision
Min Hole Diameter:
PCB Glod Process:
Immerison Gold
PCB Surface:
Double Sided Board
Pcb Assembly Method:
Copper Thickness:
Outer Package:
Payment & Shipping Terms
Minimum Order Quantity
100 piece
$0.1- $4.9
Packaging Details
Delivery Time
5-8 days
Payment Terms
L/C, D/A, D/P, T/T
Supply Ability
50000pcs per months
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Product Description

5G Communication PCB Assembly 1OZ Copper Prototype PCB Fabrication PCB Design​



5G communication to PCB processing technology


1. Material requirements: A very clear direction for 5G communication PCB is high-frequency high-speed materials and boards.


2 For the requirements of quality monitoring, due to the improvement of 5G signal rate, the deviation of the board has a greater impact on signal performance, which requires the production deviation control of the board to be stricter, and the existing mainstream board process and equipment update is not big, which will become the bottleneck of future technological development.


3. Process requirements: The functional improvement of 5G-related applications will increase the demand for high-density PCBS, and HDI will also become an important technical field.


4. Requirements for PCB design; The selection of plates should meet the requirements of high frequency and high speed, clear resistance matching, cascade planning, wiring room/etc., to meet the signal integrity requirements, which can be started from the six aspects of loss, embedding, high frequency phase/amplitude, mixed pressure, heat dissipation, PIM.


5. Requirements for equipment and instruments: high-precision equipment and pre-treatment line with less coarsing of copper surface are currently ideal processing equipment, and test equipment is passive intermodulation tester, flying needle impedance tester, loss test equipment, etc. Precision graphics transfer and vacuum etching equipment, detection equipment that can monitor and feedback data changes in real time, line width and close spacing, electroplating equipment with good uniformity, high-precision laminating equipment, etc., can also meet the production needs of 5G communication PCB.


Communications PCB Parameters​


Application field 5G Communication 
Basic material FR-4
Dielectric constant 4.2
Outer copper foil thickness 1OZ
Inner Copper Foil Thickness 1OZ
Min Hole Diameter 0.2mm
PCB Glod process Immerison Gold
Number of PCB layers 16 layers
PCB Surface Double Sided Board
Min line width 0.076 mm
Minimum line spacing 0.076 mm
Board thickness 1.6 mm
Manufacturing quality system IATF16949
Feature High reliability and precision


Communication PCB Assembly Manufacturer

Shenzhen SKY-WIN Technology Co., Ltd was founded in February 2015, focusing on PCBA OEM/ODM one-stop service, solution customization, SMT patch, DIP plug-in, functional testing, assembly and other OEM/ODM services.


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