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DIP SMT PCB Assembly Service 2 Layers Electronic Circuit Board

DIP SMT PCB Assembly Service 2 Layers Electronic Circuit Board

2 Layers PCB Assembly Service

2 Layers Electronic Circuit Board

DIP Electronic Circuit Board

Place of Origin:


Brand Name:

Sky Win



Model Number:


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Product Details
Material Of PCB:
4 Layers
Board Thickness:
Material Accuracy:
Material Consumption:
253 Pcs
PCB Quality System:
Manufacturing Quality System:
PCB Glod Process:
Immersion Gold
Payment & Shipping Terms
Minimum Order Quantity
100 piece
$0.1- $4.9
Packaging Details
Delivery Time
5-8 days
Payment Terms
L/C, D/A, D/P, T/T
Supply Ability
50000pcs per months
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Product Description

DIP/SMT PCB Assembly Lead-Free Hot Air Solder Leveling PCB 2 Layers Electronic Circuit Board



Advantages of SMT

It has a high assembly density, making electronic devices lighter in weight
It has high vibration resistance
SMT ignore reliable
Less solder joint error
SMT has high frequency reduction for electromagnetic and RF reduction
It saves on equipment costs


SMT PCB Assembly Specification


SMT Project name Item ZY-2G10G-401D PCBA
Manufacturing process SMT Patch, DIP ,AOI Test,QA self-test
Material accuracy 0402+QFP
Number of materials 73 kinds
Material consumption 275 pcs
PCB Glod process Lead-Free Hot air solder leveling
Number of PCB layers 2 layers
Material FR-4
Board thickness 1.6 mm
PCB Board Single Sided Board
Manufacturing quality system IATF16949
PCB quality system ROHS/UL
Application Changing Station, Charging pile, New energy
Value-added service 1 year after sale


SMT PCB Assembly Processing Technology requirements for PCB Design
In the process of SMT patch processing, all processing equipment has the characteristics of full automation, precision and speed. Then the PCB design must meet the requirements of SMT patch processing equipment in order to effectively guarantee product quality.

  1. PCB shape design
  2. PCB size design
  3. PCB thickness design
  4. PCB process side design
  5. PCB component layout design
  6. PCB Pad Design

Lead-Free Hot air solder leveling For SMT PCB Assembly



SMT PCB assembly process requirements are a very important factor in circuit board production, which directly determines the quality and positioning of a board.

For example, PCB Assembly HASL and immersion gold, relatively speaking, immersion gold is for high-end boards. Due to the good quality of immersion gold, it is relatively high relative to the cost.
Therefore, many customers choose the most commonly used 
Lead-Free Hot air solder leveling
Lead-free tin-spraying of PCB boards is environmentally friendly and does not contain harmful substance "lead", with a melting point of about 218 degrees; the temperature of the tin-spraying tin furnace needs to be controlled at 280-300 degrees; -270 degrees.


SMT PCB Assembly Manufacturer


Shenzhen SKY-WIN Technology Co., Ltd which is  one-stop PCBA intelligent manufacturing platform, sample/small batch, SMT patch, PCB proofing, DIP welding processing, PCB board making, full set of electronic components purchasing, one-stop PCBA manufacturing services.





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