Place of Origin:
Shenzhen,China
Brand Name:
Sky-Win Technology
Certification:
IATF16949
Model Number:
T-PCBA001
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OEM Pcb Board Assembly1-6oz Copper Thickness Electronic PCB Assembly For Efficient Performance
Electronic PCB Assembly Services offered by SkyWin
SkyWin is a premium provider of PCB and PCB assembly services for small-medium businesses with 10 years of experience in the industry. Located in Shenzhen, China, we guarantee high quality, reliable boards and manufacturing services worldwide.
Our services come with unlimited capabilities for any kind of application – be it prototype or production – including surface-mount, thru-hole and mixed technology PCB assembly and electronic manufacturing, and full turn-key provision from manufacturing to assembly and testing. We have proven to our customers that when it comes to tight tolerances and complex boards, they can count on us.
We keep our strong network of circuit assembly and manufacturing partners to provide the most advanced services for our global customers. Our minimum quantity requirement is 5pcs, and we offer best turn-around times on all demanding production schedules.
Electronic PCB Assembly Features
At our company, we provide a wide variety of PCB assembly services which you can find your suitable solution.
For example, we can provide quick-turn prototype assembly, turnkey assembly, partial turnkey assembly, consignment assembly and roHS compliant lead-free assembly.
In addition, we also offer non-RoHS assembly, conformal coating and final box-bulid and packaging services.
We warmly welcome any inquiry about PCB assembly.
Electronic PCB Assembly Specification
| Item | Capabilities |
|
Layer Count
|
1 - 32 Layers
|
|
Max Board Dimension
|
24*24" (610*610mm)
|
|
Min Board Thickness
|
0.15mm
|
|
Max Board Thickness
|
6.0mm - 8.0mm
|
|
Copper Thickness
|
Outer Layer:1oz~30oz, Inner Layer:0.5oz~30oz
|
|
Min Line Width/Line Space
|
Normal: 4/4mil (0.10mm); HDI: 3/3mil (0.076mm)
|
|
Min Hole Diameter
|
Normal: 8mil (0.20mm) ; HDI: 4mil (0.10mm)
|
|
Min Punch Hole Dia
|
0.1" (2.5mm)
|
|
Min Hole Spacing
|
12 mil (0.3mm)
|
|
Min PAD Ring(Single)
|
3mil (0.075mm)
|
|
PTH Wall Thickness
|
Normal: 0.59mil (15um); HDI: 0.48mil (12um)
|
|
Min Solder PAD Dia
|
Normal: 14mil (0.35mm); HDI: 10mil(0.25mm)
|
|
Min Soldermask Bridge
|
Normal: 8mil (0.2mm); HDI: 6mil (0.15mm)
|
|
Min BAG PAD Margin
|
5mil (0.125mm)
|
|
PTH/NPTH Dia Tolerance
|
PTH: ± 3mil (0.075mm) ; NPTH: ±2 mil (0.05mm)
|
|
Hole Position Deviation
|
±2 mil (0.05mm)
|
|
Outline Tolerance
|
CNC: ± 6mil (0.15mm); Die Punch: ± 4mil (0.1mm); Precision Die: ± 2mil (0.05mm)
|
|
Impedance Controlled
|
Value>50ohm: ±10%; Value≤50ohm: ±5 ohm
|
|
Max Aspect Ratio
|
8:01
|
|
Surface Treatment
|
ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger,
|
| Selected Gold plating,ENEPIG, ENIPIG; HAL, HASL(LF), OSP, Silver Imm., Tin Imm | |
|
Soldermask Color
|
Green/White/Black/Yellow/Blue/Red
|
Send your inquiry directly to us
