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Prototype Smt Pcba Assembly IS09001 With Electronic Product Assembly

Prototype Smt Pcba Assembly IS09001 With Electronic Product Assembly

Smt Pcba Assembly IS09001

Electronic Smt Pcba Assembly

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Product Details
Brand Name:
SMT PCB Assembly Services:
Maximum PCB Size:
1200x 500mm
4 Layer
SMT Assembly
BOM (bill Of Material) For Assembly
Payment & Shipping Terms
Minimum Order Quantity
100 piece
$0.1- $4.9
Packaging Details
Delivery Time
5-8 days
Payment Terms
L/C, D/A, D/P, T/T
Supply Ability
50000pcs per months
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Product Description

Fast Prototype PCBA Board SMT PCBA With Electronic Product Assembly


SMT PCBA Introduction

SMT PCB Assembly means Surface Mount Technology, known as a a kind of Circuit assembly technology that installs the SMC/SMD (named Chip Components in Chinese) on the surface of Printed Circuit Board or on the surface of other substrates, which is solded and assembled by means of reflow soldering or dip soldering. It realizes high density, high reliability, miniaturization and low cost of electronic product assembly.

SMT is a flexible and powerful assembly process that has allowed manufacturers to produce modern devices with ever-smaller footprints


Advantage Of SMT PCBA

Shenzhen Sky Win Technology offers the latest most advanced surface mount technology (SMT) for high speed production and accuracy, thru-hole technology and detailed hand assembly to meet all of your electronic assembly requirements, from prototyping to high volume production. Outsourcing your electronic assembly requirements are a key decision for your company. Please contact us for support !


PCB Assembly Capability

Maximum PCB size 1200x 500mm
Minimum PCB thickness 0.25mm
Minimum chip size 0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size 74x74mm
BGA ball pitch 1.00mm (minimum), 3.00mm (maximum)
Assembly type Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement
SMT PCB assembly services BGA/ uBGA/ POP/PLCC/SOIC/QFP/QFN


Preparation For SMT PCB Assembly Before Processing

Generally, before the SMT patch processing is processed, in order to produce smooth production in order to ensure that it can be completed on time, some preparations need to be prepared before formal production:


Schedule production plans

According to customer's requirement, make production-scheduling plan, and make production scheduling according to relevant material availability.

Project confirmation

According to the production-scheduling plan, arrange preparation 4 hours in advance: steel mesh, fixture audit, BOM data, patch procedure, production process, material special requirements and other samples follow up and complete.

Check the materials

According to the production plan, the material clerk shall check the production materials combined with the list of ingredients, and send them to each line after the inventory is completed. According to the technical requirements, the return temperature of the solder paste shall be made in advance.

Check the device

Check the air pressure supply must be above 05.MPa. Check Feeder must be installed horizontally. According to the production plan, engineers prepare the program for the proofing products in advance.

Commissioning production

According to customer products and BOM, debug production. Before production, check the quality of printing solder paste, whether the material of the SMT machine is good, and whether the Feida is placed according to standard. After all confirmation, the production can start.


SMT PCB Assembly Picture

Prototype Smt Pcba Assembly IS09001 With Electronic Product Assembly 0



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