DIP SMT PCB Assembly Multilayer With IATF16949 Certification​

4 Layer Multilayer 1oz ENIG FR4 Green Soldmask Support SMT And DIP PCB Assembly With IATF16949/ROHS Certification​

PCB assembly plays a crucial role in the electronics industry, enabling the creation of complex electronic devices and systems. The topic at hand revolves around a specific type of PCB assembly, namely the 4-layer multilayer 1oz ENIG FR4 Green Soldmask PCB assembly that supports both surface mount technology (SMT) and dual in-line package (DIP) components. This particular assembly boasts the esteemed IATF16949 and ROHS certifications, ensuring the highest standards of quality and environmental compliance.

The term "4-layer multilayer" refers to the construction of the PCB, consisting of four layers of conductive material stacked together to create a compact and efficient circuitry layout. This configuration allows for increased complexity and functionality in electronic devices. The use of FR4 as the base material for the PCB provides excellent electrical insulation and mechanical strength, ensuring reliable performance and durability.

ENIG, short for Electroless Nickel Immersion Gold, is a widely adopted surface finish for PCBs. It offers excellent solderability, corrosion resistance, and flatness, making it suitable for various applications. The 1oz specification indicates the thickness of the copper layer, ensuring optimal conductivity while maintaining a manageable overall board thickness.

The green solder mask applied to the PCB serves multiple purposes. It provides insulation between conductive traces, preventing short circuits and improving the overall reliability of the assembly. Additionally, the green color aids in visual identification and assists in the manufacturing and testing processes.

One of the distinguishing features of this PCB assembly is its support for both SMT and DIP components. Surface mount technology involves mounting components directly onto the surface of the PCB, allowing for smaller form factors and automated assembly processes. On the other hand, dual in-line package components have leads that are inserted into holes on the PCB, requiring additional space but offering certain advantages in specific applications. The ability to accommodate both types of components ensures flexibility and compatibility for a wide range of electronic designs.

The inclusion of IATF16949 and ROHS certifications highlights the commitment to quality and environmental responsibility. The IATF16949 certification signifies compliance with strict automotive industry standards, ensuring that the PCB assembly meets the rigorous requirements of automotive applications. The ROHS certification confirms that the assembly is free from hazardous substances, promoting sustainability and environmental protection.

In conclusion, the 4 Layer Multilayer 1oz ENIG FR4 Green Soldmask Support SMT And DIP PCB Assembly With IATF16949/ROHS Certification offers a high-quality, versatile, and environmentally friendly solution for electronic manufacturing. Its multilayer design, advanced surface finish, and compatibility with SMT and DIP components make it an ideal choice for various industries, including automotive, consumer electronics, telecommunications, and more.

Specification of SMT PCB Assembly of Picture

Why is SMT needed to produce PCB assmbly?

PCB (Printed Circuit Board) is a key component in electronic products, used to connect and support electronic components. In the PCB assembly process, two main technologies are usually used: SMT (Surface Mount Technology) and THT (Through-Hole Technology). And the application of SMT in PCB assembly has many important advantages, the following are some of them:

1. Size and weight: SMT assembly technology allows for higher component density and smaller dimensions. Since components are soldered directly to the PCB surface without passing through jacks, the size and weight of the board can be greatly reduced. This is important for the miniaturization and lightweighting of modern electronic devices.
2. Automation and efficiency: SMT is a highly automated technology suitable for mass production. By using automated equipment, such as a placement machine (Pick and Place machine), components can be placed on the PCB quickly and accurately with precision. In contrast, THT requires manual insertion of components and an additional process during soldering. As a result, SMT can increase productivity and assembly consistency.
3. High-frequency characteristics and performance: Because SMT components are attached directly to the PCB surface, they can transmit signals more efficiently. For high frequency circuits and high speed data transmission applications, SMT components typically have lower inductance and capacitance, and can provide better high frequency characteristics and performance.
4. Reliability and quality: SMT soldered connections are typically more reliable than THT because soldered joints are more robust and better able to resist external vibration and shock. In addition, SMT technology offers better solder quality control and inspection methods, allowing processes such as automatic optical inspection (AOI) to check the quality of soldered connections.

As an excellent PCBA manufacturer in China, Shenzhen Sky-win offers advanced SMT services, which means we have the capability to use SMT technology for high quality PCB assembly. We can provide efficient, accurate and reliable SMT assembly services to meet our customers' needs for miniaturized, high-performance and high-reliability electronic products.